M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
February 22, 2024 -- M31 Technology Corporation (M31), a member of the Intel Foundry Accelerator IP Alliance, today showcased M31's silicon intellectual properties (IP) R&D capabilities at Intel Foundry's inaugural Direct Connect event, enabling customers to leverage M31's complete IP solutions to further advance system-on-chip (SoC) innovation for advanced applications such as artificial intelligence, high-speed computing, Edge-IOT and automotive.
In globally popular application fields, high complexity in advanced process technology is required. As one of the few global IP providers of advanced process IP technologies, M31 has become a key player in driving semiconductor design innovation. M31 offers a full range of market-leading IP solutions and comprehensive IP integration services to meet designers' specifications and requirements, giving customers an edge in accelerating designs. With M31's competitive performance and latest specification high-speed interface IP products, including USB4, PCIe 5.0, MIPI C/D PHY, etc., customers can accelerate and optimize the required designs for data transfer/storage, image processing, memory, and other related applications by immediately adopting M31's silicon-proven IP solutions portfolio. Moreover, M31 has expanded its R&D capabilities in Foundation IP over the past year, focusing on the development of standard cell libraries, memory compilers, and I/O for advanced manufacturing processes. M31 possesses a comprehensive portfolio of industry-standard IP, coupled with customized technology and R&D experience, enabling customers to seize the time-to-market opportunities.
Scott Chang, CEO of M31, said at the meeting, “M31 possesses a comprehensive portfolio of silicon-proven IP products, and we are also actively developing solutions for extremely advanced processes, expanding IP R&D resources to accelerate product development for our mutual customers and partners, meeting the high-quality and high-performance requirements of SOC design.”
At IFS Direct Connect Event, Left to Right, Suk Lee,VP of Design Ecosystem Development at Intel Foundry Services; Scott Chang, CEO of M31; Kuoshu Chiu, GM of M31 USA
|
M31 Technology Corp. Hot IP
- USB 3.2 Gen2/Gen1 PHY IP in TSMC(5nm,6nm, 7nm,12nm/16nm, 22nm, 28nm, 40nm, 55nm)
- PCIe 4.0 PHY in TSMC(6nm,7nm, 12nm,16nm)
- MIPI M-PHY v3.1 IP in TSMC(12/16nm, 28nm, 40nm, and 55nm)
- MIPI D-PHY RX/TX v1.1 / v1.2 IP in TSMC (12/16nm, 28nm, 40nm, and 55nm process)
- SerDes PHY IP in TSMC (7nm, 12/16nm, 22nm, 28nm)
Related News
- Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's
- M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements
- Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
- Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
E-mail This Article | Printer-Friendly Page |