After TSMC fab in Japan, advanced packaging facility is next
By Majeed Ahmad, EDN (March 18, 2024)
Japan’s efforts to reboot its chip industry are likely to get another boost: an advanced packaging facility set up by TSMC. That seems a logical expansion to TSMC’s $7 billion front-end chip manufacturing fab built in Kumamoto on Japan’s southern island Kyushu.
In other words, a back-end packaging facility will follow the front-end fab to complement the chip manufacturing ecosystem in Japan amid considerations to diversify semiconductor supply chains beyond Taiwan due to geopolitical tensions. Trade media has been abuzz about TSMC setting up an advanced packaging plant and a new Reuters report supports this premise.
E-mail This Article | Printer-Friendly Page |
Related News
- TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology
- GUC Taped Out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC Advanced Packaging Technology
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- TSMC in "Due Diligence" on Possible Japan Fab
- GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric Advanced Packaging Technology
Breaking News
- Thalia's AMALIA 24.2 introduces pioneering estimated parasitics feature to reduce PEX iterations by at least 30%
- TSMC plans 1.6nm process for 2026
- Qualitas Semiconductor Partners with TUV Rheinland Korea to Enhance ISO 26262 Functional Safety Management System
- M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
Most Popular
- Controversial former Arm China CEO founds RISC-V chip startup
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing