Rapidus Set to Open 2-nm Pilot Fab, CEO Says
By Alan Patterson, EETimes (June 19, 2024)
Japanese startup foundry Rapidus is set to open the company’s 2-nm pilot fab in April 2025, CEO Atsuyoshi Koike told EE Times in an interview. The big hurdles for the new rival of Taiwan Semiconductor Manufacturing Co. (TSMC) and Samsung still lie ahead, according to an analyst who recently visited Rapidus in Japan.
Rapidus and TSMC are two chipmakers that the Japanese government is counting on to rebuild the nation’s declining semiconductor industry. Rapidus, if successful, will make leading-edge 2-nm chips, while TSMC will make less advanced silicon at its established base in Kumamoto, Japan.
E-mail This Article | Printer-Friendly Page |
|
Related News
- Consortium forms Rapidus to get Japan back into chip race at 2nm
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
- NEDO Approves Rapidus' FY2024 Plan and Budget for "Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration"
- Rapidus and Tenstorrent Partner to Accelerate Development of AI Edge Device Domain Based on 2nm Logic
- Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
Breaking News
- Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems
- Enosemi and GlobalFoundries announce the availability of silicon-validated electronic-photonic design IP available in the GF Fotonix platform
- Arm Announces Appointment of Young Sohn to its Board of Directors
- Axiomise launches Essential Introduction to Practical Formal Verification Training
- intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam
Most Popular
- Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC
- Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
- Imagination Announces Highest Performance Automotive GPU IP with FuSa Advancement
- Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
- Sondrel appoints new Head of Projects