QuickLogic Announces $5.26 Million Contract Award
SAN JOSE, Calif., July 8, 2024 -- QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, ruggedized FPGAs and endpoint AI solutions, announced today it has been awarded a $5.26 million Contract to continue the development and demonstration of a Strategic Radiation Hardened (SRH) high reliability Field Programmable Gate Array (FPGA) technology to support identified and future Department of Defense (DoD) strategic and space system requirements.
"QuickLogic is honored to have been chosen by the US Government to continue as the Prime Contractor for this highly specialized and mission critical program," said Brian Faith president and CEO of QuickLogic. "This project builds on the company's 30+ year heritage of delivering FPGA technology to Aerospace companies and Defense Industrial Base (DIB) and will extend our capabilities to support SRH design objectives."
About QuickLogic
QuickLogic Corporation (NASDAQ: QUIK) is a fabless semiconductor company that develops innovative embedded FPGA (eFPGA) Hard IP, discrete FPGAs, and FPGA SoCs for a variety of industrial, aerospace and defense, edge and endpoint AI, consumer, and computing applications. Our wholly owned subsidiary, SensiML Corporation, completes the end-to-end solution portfolio with AI / ML software that accelerates AI at the edge/endpoint. For more information, visit quicklogic.com.
|
QuickLogic Corp. Hot IP
Related News
- QuickLogic Awarded a $6.9 Million Base Contract to Develop Strategic Radiation Hardened FPGA Technology
- Everspin Announces Contract to Provide MRAM Technology for Strategic Radiation Hardened FPGA
- Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro
- Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology
- QuickLogic Raises Approximately $3.2 Million with Strategic Investment by Institutional Investors
Breaking News
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Secure-IC unveils its Securyzr™ neo Core Platform at Embedded World North America 2024
- OPENEDGES Technology Achieves ISO 26262 ASIL-B Certification
- Xylon's Updated logiHSSL IP Core Seamlessly Connects Infineon AURIX Microcontrollers with AMD Adaptive SoCs and FPGAs
- Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports
Most Popular
- RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs
- NVMe Updates Expand Discoverability, Security
- BrainChip Introduces Lowest-Power AI Acceleration Co-Processor
- Bluetooth® V6.0 Channel Sounding RF Transceiver IP Core in 22nm & 40nm for ultra-low power distance aware Bluetooth connected devices
- Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
E-mail This Article | Printer-Friendly Page |