Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP
September 26, 2024 -- EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE Systems as a key partner for the STEAM PIPE project to provide a power-optimized very short-reach SerDes IP solution.
EXTOLL is supplying BAE Systems with the technology to develop and deliver advanced microelectronics for the U.S. Defense Industrial Base as part of their Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project –
Click for more:
BAE Systems to deliver advanced microelectronics to U.S. defense industrial base | BAE Systems
“This collaboration emphasizes EXTOLL´s strength in ultra-low power design, particularly in the 12nm process geometry. We are happy and honored to jointly work with BAE Systems, a renowned industry leader on critical solutions for the highly demanding aerospace and defense segments.”, says Dirk Wieberneit, CEO of EXTOLL.
EXTOLL´s IP is optimized to deliver highest speeds at smallest footprint and lowest power consumption, enabling a super energy-efficient solution for chiplet-based systems. The SerDes IP core supports line speeds up to 32 Gbps per lane and comes with generic support of various protocols and availability in 12 - 22nm process nodes.
Please address your inquiries to sales@extoll.com and visit our website at www.extoll.com.
About EXTOLL
EXTOLL, a leading supplier of high-speed and ultra-low power SerDes and Chiplet connectivity, designs and develops semiconductor IP with the smallest footprints and highest PPA in the industry, serving the worldwide market of ASIC, SoC- and Chiplet-Makers in various segments. The portfolio provides customers with tailored solutions for their systems covering NoC (Network-on-Chip) and Die-to-Die interfaces.EXTOLL delivers innovative solutions to enable customers to successfully migrate into the Chiplet Age.
Find out more about our products and solutions – please visit us at www.extoll.com
|
Related News
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP
- EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
- Alphawave IP Receives Prestigious 2021 TSMC OIP Partner of the Year Award for High-Speed SERDES IP
- Alphawave IP Receives Prestigious 2020 TSMC OIP Partner of the Year Award for High-Speed SerDes IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |