ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices
MOUNTAIN VIEW, Calif. -- Jan 17, 2018 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that ASR Microelectronics (Shanghai) Co., Ltd., has licensed multiple CEVA technologies for its upcoming system-on-chip (SoC) products for smartphones and narrowband IoT (NB-IoT) edge devices. ASR will incorporate a range of CEVA IP into its wireless products to power cellular, Bluetooth and Wi-Fi connectivity and enable emerging applications in computer vision, voice and audio.
Vincent Tai, CEO of ASR, commented: "CEVA provides a comprehensive portfolio of technologies for smart and connected devices, which perfectly meets our stringent requirements for cost-effective, low-power technologies. As a key IP partner to ASR, CEVA contributes significant value to our products, enabling us to offer best-in-class modem, connectivity, vision and sound specifications for the smartphone and IoT markets."
Gideon Wertheizer, CEO of CEVA, commented: "We are delighted to announce that ASR chose to deploy multiple CEVA technologies in its SoCs. It is a testimony to our value proposition as a one-stop IP house for vision, voice, cellular and connectivity technologies. We look forward to a long and successful relationship with ASR as they address the burgeoning smartphone and IoT markets."
About ASR Microelectronics (Shanghai) Co., Ltd.
ASR is a China based fabless semiconductor company, having leadership in 2G, 3G, 4G and next-generation wireless technologies. The company's diverse product portfolio includes thin modem, handset and IOT solutions that power the entire wireless and consumer electronics markets. Founded in April 2015, ASR is funded by leading corporation and investment institution in China, and headquartered in Shanghai, China with R&D centers in Shanghai, Beijing, Chengdu, Dalian, Hefei, USA and Korea, technical support center in Shenzhen. In May 2017, ASR completed the acquisition of the Marvell MBU (Mobile Business Unit).
About CEVA, Inc.
CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (802.11 a/b/g/n/ac up to 4x4). Visit us at www.ceva-dsp.com
|
Ceva, Inc. Hot IP
Related News
- CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices
- Altek License CEVA Imaging and Vision DSP for Deep Learning in Mobile Devices
- CEVA Introduces New Low Power Communication DSPs to Address the Multimode Connectivity Requirements of IoT and M2M
- Leadcore Technology License CEVA DSP Technologies for Mobile Devices
- Ceva Launches Multi-Protocol Wireless Platform IP Family to Accelerate Enhanced Connectivity in MCUs and SOCs for IoT and Smart Edge AI Applications
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
E-mail This Article | Printer-Friendly Page |