Analysis: Outpaced by TSMC, GloFo cuts its cloth
August 28, 2018 // By Peter Clarke, eeNews
Globalfoundries' lack of business success at the leading-edge of FinFET foundry work means it can no longer afford to pursue a twin FinFET and FDSOI development strategy and is stopping all 7nm development. Putting it simply Globalfoundries has been outpaced by TSMC and as a result has had to take a long hard look at itself in the mirror. It has decided to cut its cloth according to its means. But will its decision to go "differentiated" ultimately bring a reward?
Globalfoundries has also done what may seem illogical and said it intends to invent the fab-lite foundry. That is the implication of dividing Globalfoundries' business between a foundry part and an ASIC development business that is free to go other foundries at 7nm and beyond. What we do not yet know is how significant a business that will be as a proportion of the whole. It seems unusual and may receive double-takes from potential customers before its receives their business.
E-mail This Article | Printer-Friendly Page |
Related News
- TSMC Cuts Expansion Plan to $36B as Outlook Sours
- Moortec Launches New In-Chip Technology for Highly Distributed, Real-Time Thermal Analysis on TSMC N5 Process
- Cadence Expands Capabilities of Integrated Design and Analysis Flow for TSMC InFO Packaging Technology
- TSMC Cuts Capex by $1 Billion
- Yoshida in Japan: Renesas' cuts are GloFo's gain
Breaking News
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
- Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
- TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process