Siemens EDA faces Chinese startup competitor
By Peter Clarke, eeNews Europe (January 1, 2024)
SEIDA (Hangzhou, China) is an EDA startup formed in 2021 by Chinese engineers that had previously worked for Siemens EDA, formerly Mentor Graphics.
The company is focusing on optical proximity correction (OPC) according to a Reuters report. OPC is a key stage in adapting the images used in chip lithography to compensate for optical interference and other effects that are inherent in the lithographic process.
The company’s CEO is Liguo ‘Recoo’ Zhang. Zhang was another former Siemens EDA employee who had spent time employed by the from in Silicon Valley. Peilun “Allen” Chang is SEIDA’s chief operating officer, Reuters said.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Secafy selects Siemens' EDA tools for innovative hardware security development
- China's EDA startup X-Epic forced to lay off staff, says report
- Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
- INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with Siemens' advanced analog and mixed-signal EDA technology
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications