Blogs
-
AI Audio for Voice Enhancement: Deep into the Deep - Part 3
(Tuesday, September 26, 2023)
-
Formal verification best practices: investigating a deadlock
(Tuesday, September 26, 2023)
-
Renesas Collaborates on Large Language Model Generative AI Chip Design
(Friday, September 22, 2023)
-
Samsung Foundry and Synopsys Accelerate Multi-Die System Design
(Friday, September 22, 2023)
-
Demystifying the Qualification Process for Automotive Certification: ISO 26262 Compliance for CSI IP Products and Reliability Testing
(Friday, September 22, 2023)
-
New Unified Electrostatic Reliability Analysis Solution Has Your Chip Covered
(Thursday, September 21, 2023)
-
Formal verification best practices to reach your targets
(Tuesday, September 19, 2023)
-
VESA Display Stream Compression (DSC) Encoder IP Core
(Tuesday, September 19, 2023)
-
Focus on Memory at AI Hardware Summit
(Tuesday, September 19, 2023)
-
Configurable LLDB for (not only) embedded RISC-V processors
(Monday, September 18, 2023)
-
Together, we are building the future of computing, on Arm
(Monday, September 18, 2023)
-
Infineon Drives Automotive MCU Performance Higher with Synopsys Interface IP
(Monday, September 18, 2023)
-
Verification of Integrity and Data Encryption (IDE) for CXL Devices
(Thursday, September 14, 2023)
-
How to Unlock the Power of Operator Fusion to Accelerate AI
(Thursday, September 14, 2023)
-
Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems
(Wednesday, September 13, 2023)
-
Arm's Pitch
(Tuesday, September 12, 2023)
-
Reviewing different Neural Network Models for Multi-Agent games on Arm using Unity
(Tuesday, September 12, 2023)
-
Configurable LLDB for (not only) embedded RISC-V processors
(Tuesday, September 12, 2023)
-
Common Tensilica Software Stack Delivers Best-In-Class Edge AI Performance
(Monday, September 11, 2023)
-
Empowering AI-Enabled Systems with MIPI C/D-PHY Combo IP: The Complete Audio-Visual Subsystem and AI
(Monday, September 11, 2023)
-
How PCI Express Gives AI Accelerators a Super-Fast Jolt of Throughput
(Monday, September 11, 2023)
-
AI-Based Sequence Detection for IP and SoC Verification & Validation
(Monday, September 11, 2023)
-
Introducing Next-Generation Verdi Platform for AI-Driven Debug and Verification Management
(Friday, September 8, 2023)
-
Introducing Fab.da: A Comprehensive, AI-Powered Solution for Efficient Semiconductor Manufacturing
(Thursday, September 7, 2023)
-
Introducing PCIe's Integrity and Data Encryption Feature (IDE)
(Wednesday, September 6, 2023)
-
BLE Supercharges Electronic Shelf Labels for Retail
(Tuesday, September 5, 2023)
-
Functional, Fast, and Ultra-Low Power: A Live Look at Weebit's Second IP Module
(Tuesday, September 5, 2023)
-
Interface IP in 2022: 22% YoY growth still data-centric driven
(Tuesday, September 5, 2023)
-
TechInsights Finds SMIC 7nm (N+2) in Huawei Mate 60 Pro
(Tuesday, September 5, 2023)
-
First macOS release of Arm Performance Libraries
(Friday, September 1, 2023)
-
How the SYCLOPS project democratizes AI acceleration
(Thursday, August 31, 2023)
-
Huawei's 5G Phone
(Thursday, August 31, 2023)
-
Smart Manufacturing Makes Semiconductor Fabrication and Advanced Electronics Possible
(Thursday, August 31, 2023)
-
A Step Closer to Post-Quantum Cryptography Standards
(Thursday, August 31, 2023)
-
Synopsys Acquires PikeTec Software Engineering, Enhancing Electronics Digital Twins Platform
(Tuesday, August 29, 2023)
-
FPGA Chiplets Get a Power and Cost Makeover Thanks to New Partnership
(Monday, August 28, 2023)
-
NIST Published the Drafts of the Forthcoming PQC Standards
(Monday, August 28, 2023)
-
How Qualcomm Accelerated Coverage Closure with AI-Driven Verification
(Friday, August 25, 2023)
-
Transformer Networks Optimized for ChatGPT Mobile
(Thursday, August 24, 2023)
-
How Low Can You Go? An Inside Look at Weebit ReRAM Power Consumption
(Thursday, August 24, 2023)
-
What Are Digital Twins? A Primer on Virtual Models
(Thursday, August 24, 2023)
-
How Google and Arm Collaborate on the Next Wave of Cloud Infrastructure
(Wednesday, August 23, 2023)
-
Arm China Remains A Wild Card
(Wednesday, August 23, 2023)
-
Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform
(Wednesday, August 23, 2023)
-
RISC-V customization gets a standing ovation - no fragmentation drama!
(Wednesday, August 23, 2023)
-
Arm's Cloud EDA Success: Two Paths to Greater Value
(Tuesday, August 22, 2023)
-
The Vitality of Change: Congratulations to Sassine Ghazi!
(Thursday, August 17, 2023)
-
How to Augment SoC Development to Conquer Your Design Hurdles
(Thursday, August 17, 2023)
-
Accelerating MIPI CSI-2 Adoption in Automotive
(Wednesday, August 16, 2023)
-
What are AI Chips? A Comprehensive Guide to AI Chip Design
(Friday, August 11, 2023)
Previous
