Blogs
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SemiconIndia 2023: Alphawave Semi's Up-Close Glimpse of a Dazzling Event
(Thursday, August 10, 2023)
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One Year Later, CHIPS Act Opportunity Is Exponential
(Thursday, August 10, 2023)
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SemiconIndia 2023: Alphawave Semi's Up-Close Glimpse of a Dazzling Event
(Thursday, August 10, 2023)
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AI will be increasingly important in EDA, reducing design costs and supporting engineers
(Wednesday, August 9, 2023)
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Keeping Up with UCIe 1.1 Verification Using Synopsys VIP for UCIe
(Wednesday, August 9, 2023)
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Renesas RZ/G2M Awarded Arm SystemReady IR 1.1 Certification
(Monday, August 7, 2023)
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Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications
(Monday, August 7, 2023)
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Cadence and Arm Are Building the Future of Infrastructure
(Thursday, August 3, 2023)
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Key Considerations for Addressing Multi-Die System Verification Challenges
(Wednesday, August 2, 2023)
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What you should ask for instead of just PPA
(Tuesday, August 1, 2023)
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The Promise and Reality of Generative AI
(Monday, July 31, 2023)
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5G Evolution, the road to realizing the full extent of 5G Technology Revolution
(Monday, July 31, 2023)
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Re-targetable LLVM C/C++ compiler for RISC-V
(Monday, July 31, 2023)
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How CXL Is Improving Latency in High-Performance Computing
(Monday, July 31, 2023)
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Understanding PCIe 6.0 Shared Flow Control
(Monday, July 31, 2023)
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Designing Energy-Efficient AI Accelerators for Data Centers and the Intelligent Edge
(Thursday, July 27, 2023)
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GloFo CEO criticises fab subsidies
(Wednesday, July 26, 2023)
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Enabling the Global 800G Ecosystem with 112G Ethernet PHY IP
(Wednesday, July 26, 2023)
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New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems
(Tuesday, July 25, 2023)
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Post-quantum Cryptography/PQC: New Algorithms for a New Era
(Tuesday, July 25, 2023)
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Accelerate your time to market with Arm Approved ISP Service Partners
(Monday, July 24, 2023)
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Benefit of pruning and clustering a neural network for before deploying on Arm Ethos-U NPU
(Monday, July 24, 2023)
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A Trillion-Dollar Industry: How AI Is Reinventing EDA and Semiconductors
(Monday, July 24, 2023)
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FPGA Insights and Trends 2023: Unleashing the Power of FPGA
(Friday, July 21, 2023)
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Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process
(Thursday, July 20, 2023)
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Making the most of the 60th DAC
(Wednesday, July 19, 2023)
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Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC's N3E Process
(Wednesday, July 19, 2023)
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Revolutionizing Display Technology with VESA Display Stream Compression (DSC) Decoder IP
(Monday, July 17, 2023)
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How Do Robots Navigate?
(Thursday, July 13, 2023)
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Synopsys Protocol Verification Solution for DDR5 MRDIMM
(Thursday, July 13, 2023)
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Arm Neoverse-powered servers demonstrate HPC leadership
(Thursday, July 13, 2023)
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Quantum Safe IP: Hardware Level Security for the Quantum Computing Era
(Thursday, July 13, 2023)
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Cadence Perspective: 224G SerDes Trend and Solution
(Tuesday, July 11, 2023)
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Demystifying the Qualification Process for Automotive Certification: ISO 26262 Compliance for CSI IP Products and Reliability Testing
(Tuesday, July 11, 2023)
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ASIL B Ready Certification for SiFive Automotive Solutions
(Monday, July 10, 2023)
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Arasan Chip Systems Inc. Empowers Camera and Display Semiconductor Manufacturers with multiple -Supported Process and Integrated Subsystems, Delivering Cost and Time Savings
(Monday, July 10, 2023)
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Exploring USB Applications and the Impact of USB IP
(Thursday, July 6, 2023)
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Increasing design skills for custom compute
(Tuesday, July 4, 2023)
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IoT and Ethernet: Enabling Seamless Connectivity and Smart Solutions
(Monday, July 3, 2023)
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Smart Solutions for Standards-Compliant SoC and IP Development
(Monday, July 3, 2023)
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Push-Button NoCs for SoCs
(Friday, June 30, 2023)
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The Future of Chiplet Reliability
(Thursday, June 29, 2023)
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Introduction of Precoding in PCIe 6.0
(Thursday, June 29, 2023)
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Unleashing Innovation and Energy Efficiency at TSMC Events
(Thursday, June 29, 2023)
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Faster Hyperscale Data Centers Start with 224G Ethernet PHY IP
(Thursday, June 29, 2023)
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Custom processor design just became easier
(Thursday, June 29, 2023)
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How Head Tracking Can Elevate Your Spatial Audio Experience
(Thursday, June 29, 2023)
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Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools
(Thursday, June 29, 2023)
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Datapath Validation - Solving Verification Challenges in the Era of Artificial Intelligence and Mathematical Cores
(Tuesday, June 27, 2023)
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Vision Transformers Change the AI Acceleration Rules
(Tuesday, June 27, 2023)