Design & Reuse
Catalog of SIP Cores
System on Chip design resources
arrow Chip to Chip (12)
arrow Die-to-die (111)
arrow Intra SoC Connectivity (20)
111 IP
1
150.0
UltraLink Controller
Ultralink controller for high performance die-to-die interconnect on streaming, CXS, and AXI protocols The Cadence Ultralink Controller enables a p...
2
100.0
UCIe PHY & D2D Adapter
Neuron IP’s UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 specifica...
3
100.0
UCIe-A PHY for Advanced Package (x64) in TSMC (N7, N6, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
4
100.0
UCIe-S PHY for Standard Package (x16) in Samsung (SF5A, SF4X, SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
5
100.0
UCIe-S PHY for Standard Package (x16) in TSMC (N7, N6, N4P, N5, N3)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
6
100.0
Universal Chiplet Interconnect Express (UCIe) Controller
Synopsys UCIe Controller IP is comprised of the Die-to-Die Adapter layer and Protocol layer for widely used protocols such as PCI Express and CXL. The...
7
75.0
64G UCIe Standard PHY for TSMC
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance. The Cadenc...
8
70.0
40G UCIe PHY IP on Samsung SF4X
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI,...
9
60.0
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes pe...
10
60.0
Multi-Die interLink (GLink 2.3) IP
GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a ...
11
50.0
40G UCIe PHY for high-density advanced packages
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI,...
12
50.0
40G UCIe PHY for organic substrate standard packages
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale data center, AI,...
13
30.0
UCIe Die-to-Die Chiplet Controller
Introducing OPENEDGES’ Universal Chiplet Interconnect Express (UCIe) Controller IP, OUC, designed to transform the semiconductor landscape with innova...
14
30.0
Universal Chiplet Interconnect Express (UCIe) Controller
Integrating multiple chiplets within a single package has become crucial for high-performance computing. CoMira’s UCIe (Universal Chiplet Interconnect...
15
25.0
32G UCIe Advanced PHY for TSMC
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance. The Cadenc...
16
16.0
Die-2-die interfaces for chiplets - GPIOs for 2.5D and 3D integration
Analog I/O and on-chip Electrostatic Discharge (ESD) protection. Proven on many foundries: TSMC, UMC, GF, TowerSemi, Samsung Foundry, ... Proven in ...
17
15.0
32G UCIe Standard PHY for Samsung
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance. The Cadenc...
18
15.0
32G UCIe Standard PHY for TSMC
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance. The Cadenc...
19
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
20
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
21
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
22
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
23
14.0
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller i...
24
14.0
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller i...
25
11.0
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead...
26
11.0
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead...
27
10.0
MAXVY Universal Chiplet Interconnect Express (UCIe) Verification IP
MAXVY UCIe VIP , a state-of-the-art solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of you...
28
10.0
UCIe based 8-bit 48-Gsps Transceiver (ADC/DAC/PLL/UCIe)
Unleash the power of the new UCIe based RF Chiplet transceiver. With NEXT Semiconductor's silicon proven 8-bit, 48-Gsps Transceiver, this product ...
29
10.0
UCIe D2D Adapter
The D2D Adapter for UCIe is a scalable adapter layer between one or more protocol components and the UCIe PHY, which ensures efficient data transfer a...
30
10.0
Die-to-Die Controller IP
The Synopsys Die-to-Die Controller IP, optimized for latency, bandwidth, power and area, enables efficient inter-die connectivity in server, AI accele...
31
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in GF (12nm)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
32
10.0
Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
The Synopsys XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip modul...
33
9.0308
UCIe 2.0 PHY for Standard Package (8nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, 16GT/s, and 24GT/s with a 64...
34
9.0
IPT UCIE 2.0 CONTROLLER
High-Performance UCIe Controller IP for AI, Data Center & Consumer Applications The InPsytech UCIe 2.0 (Universal Chiplet Interconnect Express) Contr...
35
8.5077
UCIe 2.0 PHY for Advanced Package (4nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, 16GT/s, 24GT/s and 32GT/s wi...
36
8.5077
UCIe 2.0 PHY for Advanced Package (8nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, 16GT/s, and 24GT/s with a 64...
37
8.5077
UCIe 2.0 PHY for Standard Package (4nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, and 16GT/s with a 16-lane co...
38
8.5077
UCIe 2.0 PHY for Standard Package (5nm)
The UCI Express Specification Revision 2.0 supports high-speed serialization and deserialization at 4GT/s, 8GT/s, 12GT/s, and 16GT/s with a 16-lane co...
39
8.5077
UCIe Controller for Standard Package
UCIe v2.0 controller implements the D2D Adapter defined in the UCIe 2.0 specification, as well as AXI4-to-Flit protocol conversion. The D2D Adapter su...
40
8.0
TSMC CLN5FF Glink 2.0 Die-to-Die PHY
IGAD2DY01A is a high speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions：Integrated Fan-Out (InFO) with RDL ...
41
5.0556
UD28: <4gnps low-power die-to-die interface, TSMC 28nm
A silicon-proven, low-power die-to-die interface in TSMC 28nm (HPM/HPC/HPC+) for flip-chip / multi-die assembly. Separate TX-only and RX-only cells ru...
42
5.0556
UF16 D2D: <4Gbps low-power die-to-die interface, TSMC 16nm
A silicon-proven, low-power die-to-die interface in TSMC 16nm (FFC/FFC+) for flip-chip / multi-die assembly. Separate TX-only and RX-only cells run in...
43
5.0556
VX16: 600Mbps low-power D2D interface, TSMC 16nm FFC/FFC+
A custom, low-power die-to-die interface in TSMC 16nm FFC/FFC+. The bidirectional I/O cell (VX_HSIO) runs in two modes: standard full rail-to-rail swi...
44
0.0
40G Ultralink D2D PHY for GLOBALFOUNDRIES
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity. The Cadence® UltraLin...
45
0.0
40G Ultralink D2D PHY for Samsung
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity. The Cadence® UltraLin...
46
0.0
40G Ultralink D2D PHY for TSMC
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity. The Cadence® UltraLin...
47
0.0
40G Ultralink D2D PHY for TSMC N3P
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
48
0.0
40G Ultralink D2D PHY for TSMC N5P
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
49
0.0
40G Ultralink D2D PHY for TSMC N6, N7
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
50
0.0
D2D (Die-to-Die) Interconnect IP in WhiteBox, Unlimited Usage
This die-to-die interconnect IP Core is defined as an AIB IP Core, which is optimized for 32-bit AXI data transfer, enabling Master-to-Slave AXI trans...