Design & Reuse
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6 IP
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D2D PHY, ADVANCED PACKAGE, 5nm/4nm
The InPsytech (IPT) D2D PHY is a mass-production proven, state-of-the-art physical layer interface designed to provide exceptional performance and eff...
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UMI™ for Die-to-Memory (D2M) PHY IP
Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutions....
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Innovative Ultra-High-Speed Chiplet Solution
Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chip...
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Low Power Dual PHY for UCIe low cost robust Chiplets
YorChip UniPHY™ Dual PHY is a flexible version of YorChip's multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY's uni...
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XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI
These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces....
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Nutcracker XSR Connectivity Chiplet
Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to...