Design & Reuse
arrow Chip to Chip (9)
arrow Die-to-die (92)
arrow Intra SoC Connectivity (21)
9 IP
1
10.0
Chip-to-Chip IO Buffer - TSMC CLN4P
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
2
10.0
Chip-to-Chip IO Buffer - TSMC CLN5
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
3
10.0
Chip-to-Chip IO Buffer - TSMC CLN5A
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
4
10.0
Chip-to-Chip IO Buffer - TSMC CLN6FF
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
5
10.0
Chip-to-Chip IO Buffer - TSMC CLN7FF
Analog Bits’ Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra-short reach environments, using single-end...
6
0.0
UMI™ for Die-to-Memory (D2M) PHY IP
Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutions....
7
0.0
Innovative Ultra-High-Speed Chiplet Solution
Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chip...
8
0.0
XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI
These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces....
9
0.0
Nutcracker XSR Connectivity Chiplet
Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to...