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26 IP
1
100.0
UCIe PHY & D2D Adapter
Neuron IP’s UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 specifica...
2
60.0
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes pe...
3
60.0
Multi-Die interLink (GLink 2.3) IP
GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a ...
4
16.0
Die-2-die interfaces for chiplets - GPIOs for 2.5D and 3D integration
Analog I/O and on-chip Electrostatic Discharge (ESD) protection. Proven on many foundries: TSMC, UMC, GF, TowerSemi, Samsung Foundry, ... Proven in ...
5
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
6
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
7
14.0
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller i...
8
11.0
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead...
9
10.0
UCIe based 8-bit 48-Gsps Transceiver (ADC/DAC/PLL/UCIe)
Unleash the power of the new UCIe based RF Chiplet transceiver. With NEXT Semiconductor's silicon proven 8-bit, 48-Gsps Transceiver, this product ...
10
9.0
IPT UCIE 2.0 CONTROLLER
High-Performance UCIe Controller IP for AI, Data Center & Consumer Applications The InPsytech UCIe 2.0 (Universal Chiplet Interconnect Express) Contr...
11
5.0556
600Mbps Low Power D2D Interface in TSMC 16nm
Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or ...
12
5.0556
<4Gbps Low Power D2D Interface in TSMC 12/16nm
Custom die-to-die interface in 12/16nm process technology. The I/O cells are defined as TX only, and RX only and have two modes of operation, standard...
13
5.0556
<4Gbps Low Power D2D Interface in TSMC 28nm
Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation,...
14
0.0
D2D PHY, ADVANCED PACKAGE, 3nm
The InPsytech (IPT) D2D PHY IP is a state-of-the-art physical layer interface designed to provide exceptional performance and efficiency in high-speed...
15
0.0
D2D PHY, ADVANCED PACKAGE, 7nm/6nm
The InPsytech (IPT) D2D PHY is a state-of-the-art physical layer interface designed to provide exceptional performance and efficiency in high-speed da...
16
0.0
D2D PHY, STANDARD PACKAGE, 7nm/6nm
The InPsytech (IPT) D2D PHY is a state-of-the-art physical layer interface designed to provide exceptional performance and efficiency in high-speed da...
17
0.0
UCIE-A PHY, 5nm/4nm
The InPsytech (IPT) UCIe-A PHY is a mass-production proven, state-of-the-art physical layer interface designed to provide exceptional performance and ...
18
0.0
UCIE-A PHY, ADVANCED PACKAGE
The InPsytech (IPT) UCIe-A PHY is a state-of-the-art physical layer interface, offering industry-leading power efficiency and proven in mass productio...
19
0.0
Chiplet Solution
Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local r...
20
0.0
Die-to-Die PHY
Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging ...
21
0.0
Blumind Chiplet
Contact us to learn more about Neural Signal Processor known-good-die for system in package integration....
22
0.0
IPT 64GT/S UCIE-A PHY
The UCIe-A_HS 64Gbps Die-to-Die (D2D) PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects between...
23
0.0
IPT 64GT/S UCIE-S PHY,
The high-speed UCIe-S 64G is a cutting-edge standard package die-to-die (D2D) and chiplet-to-chiplet (C2C) interface IP solution designed to enable ul...
24
0.0
IPT D2D CONTROLLER
The InPsytech high-speed D2D Controller IP, optimized for power and latency enables die-to-die or chiplet-to-chiplet connectivity in applications like...
25
0.0
IPT LOW POWER UCIE-A PHY
The Ultra-low power UCIe-A Die-to-Die PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-low-power system demand with up...
26
0.0
IPT UCIE-S PHY
The IPT UCIe-S is a cutting-edge standard package die-to-die (D2D) and chiplet-to-chiplet (C2C) interface IP solution designed to enable high-speed an...