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25 IP
1
100.0
UCIe PHY & D2D Adapter
Neuron IP’s UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe-Advanced (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 specifica...
2
60.0
TSMC CLN6FF/7FF Die-to-Die Interface PHY
IGAD2DX01A is a high speed die-to-die interface PHY which transmits data through INFO RDL channels. IGAD2DX01A contains 32 Tx lanes and 32 Rx lanes pe...
3
60.0
Multi-Die interLink (GLink 2.3) IP
GUC multi-die interLink (GLink) IP provides world’s best class solution for high-bandwidth, low-power, low-latency multi-channel interconnection in a ...
4
16.0
Die-2-die interfaces for chiplets
Analog I/OS and power line ESD solutions All voltage domains (0.75V to 5V) Additional voltage (e.g. 12V in 28nm proven)...
5
14.0
40G Ultralink D2D PHY for GF12LP+
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
6
14.0
40G Ultralink D2D PHY for Samsung 7LPP
Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity The Cadence® UltraLink™ ...
7
14.0
Universal Chiplet Interconnect Express (UCIe 1.0) Controller
Ultra-low latency UCIe controller for standard industry chiplet interoperability on streaming, PCIe, and CXL protocols The Cadence UCIe™ Controller i...
8
11.0
Die-to-Die (D2D) Interconnect
Lightweight die-to-die interconnect solution optimized for highest performance with the lowest power and area overhead...
9
10.0
UCIe based 8-bit 48-Gsps Transceiver (ADC/DAC/PLL/UCIe)
Unleash the power of the new UCIe based RF Chiplet transceiver. With NEXT Semiconductor's silicon proven 8-bit, 48-Gsps Transceiver, this product ...
10
9.0
UCIE 2.0 Controller
The InPsytech UCIe 2.0 (Universal Chiplet Interconnect Express) Controller is a high-performance designe to facilitate efficient communication between...
11
5.0556
600Mbps Low Power D2D Interface in TSMC 16nm
Custom die-to-die interface in 16nm process technology. The I/O cell is bi-directional and has two modes of operation: standard rail-to-rail swing or ...
12
5.0556
<4Gbps Low Power D2D Interface in TSMC 12/16nm
Custom die-to-die interface in 12/16nm process technology. The I/O cells are defined as TX only, and RX only and have two modes of operation, standard...
13
5.0556
<4Gbps Low Power D2D Interface in TSMC 28nm
Custom die-to-die high-speed interface in 28nm process technology. The I/O cells are defined as TX only, and RX only, and have two modes of operation,...
14
0.0
2-16Gbps Die-to-Die (D2D) Multi-Protocol IO Supporting BOW, OHBI and UCIe
The AresCORE 16G Die-to-Die (D2D) IP implements a wide-parallel and clock forwarded PHY interface for multichannel interconnections up to 16Gbps. The ...
15
0.0
D2D PHY (Die-to-Die Interface)
Die-to-Die (D2D) PHY IP is based on HBM electrical specification and will also be compatible with upcoming interface standards. It is used specificall...
16
0.0
D2D Controller IP (Die-to-Die Interface)
OpenFive s Die-to-Die (D2D) Controller IP is targeted for heterogenous chiplet solutions in wired communications, AI and HPC applications. With recent...
17
0.0
33G Die-to-Die SerDes PHY (12nm 16nm)
The AnalogX AXDieIO IP utilizes the silicon-proven AXLinkIO transceiver architecture for die-to-die, in package, type of channel links....
18
0.0
25-112Gbps Extra Short-Reach (XSR) Multi-Standard SerDes (MSS)
The Alphawave DieCORE delivers the world s highest density, lowest power die-to-die connectivity solution for MCMs based on OIF XSR/USR serial standar...
19
0.0
Chiplet Solution
Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local r...
20
0.0
Die-to-Die PHY
Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging ...
21
0.0
BlueLynx Executable Generator Technology
BlueLynx&trade; technology revolutionizes the game in silicon design and engineering. Using proprietary technology, Blue Cheetah eliminates inefficien...
22
0.0
Blumind Chiplet
Contact us to learn more about Neural Signal Processor known-good-die for system in package integration....
23
0.0
IPT UCIE-A PHY, Advanced Package
The InPsytech (IPT) UCIe-A PHY is a state-of-the-art physical layer interface, offering industry-leading power efficiency and proven in mass productio...
24
0.0
IPT UCIE-A PHY, TSMC N5/N4P
The InPsytech (IPT) UCIe-A PHY is a mass-production proven, state-of-the-art physical layer interface designed to provide exceptional performance and ...
25
0.0
Bunch of Wires [BoW] PHY IP
Blue Cheetah&#39;s Bunch of Wires [BoW] PHY IP design incorporates the maximum benefit of the Open Compute Project&#39;s (OCP) inter-chiplet PHY spec...