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92 IP
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16G UCIe Standard PHY for TSMC N4P
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance The Cadence® ...
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16G UCIe Standard PHY for TSMC N5A Automotive
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance The Cadence® ...
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16G UCIe Standard PHY for TSMC N7
UCIe enables chiplet industry standard interoperability combined with ultra-low latency, extreme power efficiency, and high performance The Cadence® ...
54
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UCIe Controller for Streaming Protocols
Synopsys UCIe Controller IP is comprised of the Die-to-Die Adapter layer and Protocol layer for widely used protocols such as PCI Express and CXL. The...
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UCIe PHY IP on TSMC N3P
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
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UCIe PHY on Samsung SF5A
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netwo...
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UCIe PHY on TSMC N3E
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netwo...
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UCIe Protocol Layer: AXI-S
The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Streaming AXI Bus and the FDI interface of the UCIe D2D Adapter. It allows for...
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UCIe Standard Package PHY on Samsung S14LPP
The UCIE PHY IP is a market leading, extremely low-power, low-latency interface IP for very high bandwidth connections between two dies that are on th...
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UCIe Standard Package PHY on Samsung S8LPU
The UCIE PHY IP is a market leading, extremely low-power, low-latency interface IP for very high bandwidth connections between two dies that are on th...
61
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UCIe-A PHY for Advanced Package (x64) in Samsung (SF2)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
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UCIe-A PHY for Advanced Package (x64) in Samsung (SF4X)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
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UCIe-A PHY for Advanced Package (x64) in TSMC (N5)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
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UCIE-A PHY, 5nm/4nm
The InPsytech (IPT) UCIe-A PHY is a mass-production proven, state-of-the-art physical layer interface designed to provide exceptional performance and ...
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UCIE-A PHY, ADVANCED PACKAGE
The InPsytech (IPT) UCIe-A PHY is a state-of-the-art physical layer interface, offering industry-leading power efficiency and proven in mass productio...
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UCIe-S (Gen2) Compatible PHY for Standard Package (x16) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
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UCIe-S PHY for Standard Package (x32) in TSMC (N3P)
Synopsys UCIe PHY IP enables high-bandwidth, low-power and low-latency die-to-die connectivity in a package for hyperscale data centers, AI, and netw...
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Chiplet Solution
Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local r...
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Die-to-Die PHY
Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging ...
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GLink AXI Wrapper
GLink (GLink-fs 2.x + PCS-replay) AXI Wrapper is a digital IP designed to support AMBA AXI3/AXI4 compliant bus of user interface and provide data bus ...
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GLink CXS-Bridge
GLink (GLink-fs 2.x + PCS-replay) CXS-Bridge is a digital IP to interconnect between two dies that use Glink as a physical layer and provides AMBA CXS...
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GLink Multi-Slice PCS
GLink Multi-Slice PCS (IGDD2D004A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure consistent data arrivin...
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GLink Multi-Slice PCS
GLink Multi-Slice PCS (IGPD2D001A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure consistent data arrivin...
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Blumind Chiplet
Contact us to learn more about Neural Signal Processor known-good-die for system in package integration....
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Universal Chiplet Interconnect Express PHY IP GlobalFoundries® 22FDX®
The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications. Implemented in 22FDX technology...
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Interface Controller - PHY IP
The UCIE PHY IP is a market leading, extremely low-power, low-latency interface IP for very high bandwidth connections between two dies that are on th...
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Low Power Dual PHY for UCIe low cost robust Chiplets
YorChip UniPHY™ Dual PHY is a flexible version of YorChip’s multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY’s unique feature ...
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Low Power Dual PHY for UCIe low cost robust Chiplets
YorChip UniPHY™ Dual PHY is a flexible version of YorChip's multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY's uni...
79
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IPT 64GT/S UCIE-A PHY
The UCIe-A_HS 64Gbps Die-to-Die (D2D) PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects between...
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IPT 64GT/S UCIE-S PHY,
The high-speed UCIe-S 64G is a cutting-edge standard package die-to-die (D2D) and chiplet-to-chiplet (C2C) interface IP solution designed to enable ul...
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IPT D2D CONTROLLER
The InPsytech high-speed D2D Controller IP, optimized for power and latency enables die-to-die or chiplet-to-chiplet connectivity in applications like...
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IPT LOW POWER UCIE-A PHY
The Ultra-low power UCIe-A Die-to-Die PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-low-power system demand with up...
83
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IPT UCIE-S PHY
The IPT UCIe-S is a cutting-edge standard package die-to-die (D2D) and chiplet-to-chiplet (C2C) interface IP solution designed to enable high-speed an...
84
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TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY
IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions, Integrated Fan-Out (InFO) with the ...
85
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TSMC CLN5FF GLink 2.0 Die-to-Die PHY
IGPD2DY01A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions: Integrated Fan-Out (InFO) with RDL ...
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TSMC CLN5FF GLink 2.3LL Die-to-Die PHY
IGAD2DY04A is a high-speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions: Integrated Fan-Out (InFO) with RDL...
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TSMC CLN5FF GLink GPIO
IGID2DY01A GLink GPIO is one of the GLink series IPs. It provides low speed (up to 500 MHz) connection between two dies without requiring any initiali...
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TSMC CLN5FF GLink-3D Die-to-Die Master PHY
IGAD2DY02A is a GLink-3D high speed die-to-die interface Master PHY. It is used to transmit data between dies and assembled using TSMC System on Integ...
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TSMC CLN6FF/7FF Die-to-Die Interface PHY
This IGAD2DX01A test report shows the functional and characterization test result of GUC Die-to-Die Interface PHY IP for 8 Gbps operation. For IP deta...
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TSMC CLN7FF GLink-3D Die-to-Die Slave PHY
IGAD2DX03A is a GLink-3D high speed die-to-die interface Slave PHY. It is used to transmit data between dies and assembled using TSMC System on Integr...
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XSR PHY for TSMC N5
The Synopsys USR/XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip m...
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Automotive-Compliant Synopsys UCIe Controller IP
Synopsys UCIe Controller IP is comprised of the Die-to-Die Adapter layer and Protocol layer for widely used protocols such as PCI Express and CXL. The...