Design & Reuse
Catalog of SIP Cores
System on Chip design resources
arrow Chip to Chip (12)
arrow Die-to-die (109)
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141 IP
101
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Chiplet Solution
Based on the traditional advantages of SerDes and DDR IP, KNiulink Semiconductor has launched a solution that meets the UCIe standard based on local r...
102
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Die-to-Die PHY
Eliyan uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging ...
103
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FlexNoC® 5 Interconnect IP
FlexNoC® Interconnect IP by Arteris is used by the world’s top semiconductor design teams as the backbone for on-chip communications in chips that tar...
104
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FlexWay® Interconnect IP
Arteris FlexWay® 5 network-on-chip (NoC) IP is particularly well suited to cost-efficient, low-power IoT edge devices and microcontrollers (MCUs). ...
105
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GLink AXI Wrapper
GLink (GLink-fs 2.x + PCS-replay) AXI Wrapper is a digital IP designed to support AMBA AXI3/AXI4 compliant bus of user interface and provide data bus ...
106
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GLink CXS-Bridge
GLink (GLink-fs 2.x + PCS-replay) CXS-Bridge is a digital IP to interconnect between two dies that use Glink as a physical layer and provides AMBA CXS...
107
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GLink Multi-Slice PCS
GLink Multi-Slice PCS (IGDD2D004A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure consistent data arrivin...
108
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GLink Multi-Slice PCS
GLink Multi-Slice PCS (IGPD2D001A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure consistent data arrivin...
109
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Ultra Accelerator Link（UALink) Controller
Full-stack, scalable, configurable UALink Transaction Layer (TL), Data Link Layer (DL), and Physical Layer (PL), interconnect IP for next-generation A...
110
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Blumind Chiplet
Contact us to learn more about Neural Signal Processor known-good-die for system in package integration....
111
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UMI™ for Die-to-Memory (D2M) PHY IP
Unlike fixed unidirectional die-to-die solutions, NuLink technology is able to deliver low-power and high-performance D2M solutions....
112
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Universal Chiplet Interconnect Express PHY IP GlobalFoundries® 22FDX®
The Racyics UCIe PHY is an energy-efficient chiplet interconnect IP solution for consumer and automotive applications. Implemented in 22FDX technology...
113
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Innovative Ultra-High-Speed Chiplet Solution
Innosilicon INNOLINK™ IP provides a leading-edge chiplet solution allowing massive amounts of low-latency data to pass seamlessly between smaller chip...
114
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Interconnect fabric IP with cache coherence support
StarNoC-500 is StarFive's first self-developed interconnect fabric IP with cache coherence support, supporting the construction of multi-cores and SoC...
115
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Interconnect fabric IP with cache coherence support
StarNoC-700 is StarFive's self-developed high-scalable, high-performance interconnect fabric IP supporting cache coherence, enabling the construction ...
116
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Interconnect Technology
EXTOLL introduces a new interconnection network architecture for High-Performance Computing, which brings a rich set of features to the HPC applicatio...
117
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Interface Controller - PHY IP
The UCIE PHY IP is a market leading, extremely low-power, low-latency interface IP for very high bandwidth connections between two dies that are on th...
118
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NoC Generator
A web-based NOC configuration tool for generating and simulating Coherent and Non-Coherent NoCs...
119
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CodaCache® Last Level Cache IP
CodaCache® addresses modern design challenges through performance-optimized caching, efficient data access, and power optimization techniques. It also...
120
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Low Power Dual PHY for UCIe low cost robust Chiplets
YorChip UniPHY™ Dual PHY is a flexible version of YorChip’s multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY’s unique feature ...
121
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Low Power Dual PHY for UCIe low cost robust Chiplets
YorChip UniPHY™ Dual PHY is a flexible version of YorChip's multi-protocol PHY which supports UCIe and BOW standards. The Dual PHY's uni...
122
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XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI
These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces....
123
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IPT 64GT/S UCIE-A PHY
The UCIe-A_HS 64Gbps Die-to-Die (D2D) PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects between...
124
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IPT 64GT/S UCIE-S PHY,
The high-speed UCIe-S 64G is a cutting-edge standard package die-to-die (D2D) and chiplet-to-chiplet (C2C) interface IP solution designed to enable ul...
125
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IPT D2D CONTROLLER
The InPsytech high-speed D2D Controller IP, optimized for power and latency enables die-to-die or chiplet-to-chiplet connectivity in applications like...
126
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IPT LOW POWER UCIE-A PHY
The Ultra-low power UCIe-A Die-to-Die PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-low-power system demand with up...
127
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IPT UCIE-S PHY
The IPT UCIe-S is a cutting-edge standard package die-to-die (D2D) and chiplet-to-chiplet (C2C) interface IP solution designed to enable high-speed an...
128
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TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY
IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions, Integrated Fan-Out (InFO) with the ...
129
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TSMC CLN5FF GLink 2.0 Die-to-Die PHY
IGPD2DY01A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions: Integrated Fan-Out (InFO) with RDL ...
130
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TSMC CLN5FF GLink 2.3LL Die-to-Die PHY
IGAD2DY04A is a high-speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions: Integrated Fan-Out (InFO) with RDL...
131
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TSMC CLN5FF GLink GPIO
IGID2DY01A GLink GPIO is one of the GLink series IPs. It provides low speed (up to 500 MHz) connection between two dies without requiring any initiali...
132
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TSMC CLN5FF GLink-3D Die-to-Die Master PHY
IGAD2DY02A is a GLink-3D high speed die-to-die interface Master PHY. It is used to transmit data between dies and assembled using TSMC System on Integ...
133
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TSMC CLN6FF/7FF Die-to-Die Interface PHY
This IGAD2DX01A test report shows the functional and characterization test result of GUC Die-to-Die Interface PHY IP for 8 Gbps operation. For IP deta...
134
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TSMC CLN7FF GLink-3D Die-to-Die Slave PHY
IGAD2DX03A is a GLink-3D high speed die-to-die interface Slave PHY. It is used to transmit data between dies and assembled using TSMC System on Integr...
135
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eSPI Controller RTL SystemVerilog IP
Digital Blocks' DB-eSPI-Controller-AMBA is a fully synthesizable SystemVerilog IP Core conforming to the eSPI 1.6 Specification for Controller (Master...
136
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eSPI Controller/Target RTL SystemVerilog IP
Digital Blocks' DB-eSPI-Controller-Target-AMBA is a highly versatile, fully synthesizable SystemVerilog IP Core conforming to the eSPI 1.6 Specificati...
137
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eSPI Target RTL SystemVerilog IP
Digital Blocks' DB-eSPI-Target-AMBA is a fully synthesizable SystemVerilog IP Core conforming to the eSPI 1.6 Specification for Target (Slave) applica...
138
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XSR PHY for TSMC N5
The Synopsys USR/XSR PHY IP for 112Gbps per lane die-to-die connectivity enables high-bandwidth ultra and extra short reach interfaces in multi-chip m...
139
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Nutcracker XSR Connectivity Chiplet
Core and analog logic may not always deploy at the same time in the same process. Maturing high performance analog typically takes longer in moving to...
140
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Automotive-Compliant Synopsys UCIe Controller IP
Synopsys UCIe Controller IP is comprised of the Die-to-Die Adapter layer and Protocol layer for widely used protocols such as PCI Express and CXL. The...
141
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Synopsys UCIe Controller IP for Automotive
Synopsys UCIe Controller IP is comprised of the Die-to-Die Adapter layer and Protocol layer for widely used protocols such as PCI Express and CXL. The...