Aug. 05, 2025 –
Key highlights:
BEAVERTON, Ore.-- August 5, 2025 --Universal Chiplet Interconnect Express™ (UCIe™) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard. The new specification delivers significant performance enhancements, most notably support for 48 GT/s and 64 GT/s data rates, alongside incremental architectural updates to meet growing industry demand for high-speed, interoperable chiplet solutions.
The UCIe 3.0 specification also introduces enhancements such as runtime recalibration for improved power efficiency and extended sideband reach that supports more flexible multi-chip configurations. Additional manageability features like early firmware download and priority sideband packets increase system responsiveness and reliability. The specification’s optional manageability features give companies the flexibility to implement only what they need, enabling broad adoption while allowing design customization without unnecessary silicon.
Together, these advancements reflect the Consortium’s commitment to driving innovation in the chiplet ecosystem by improving bandwidth density, power efficiency, and system-level manageability, key enablers for scalable multi-chip System-in-Package (SiP) designs. As a result, the 3.0 specification enables greater scalability, flexibility, and interoperability to accelerate innovation in modular semiconductor design.
“UCIe 3.0 represents a critical step forward for the chiplet industry, delivering the speed, efficiency, and manageability needed to scale multi-chip designs,” said Cheolmin Park, UCIe Consortium President and Corporate VP, Samsung Electro-Mechanics. “With increased data rates and extended manageability capabilities, the next generation of UCIe technology will empower developers to build more flexible, interoperable, and high-performance SiP solutions as we all work together to build a truly open and interoperable chiplet ecosystem.”
UCIe 3.0 Specification Highlights:
The UCIe 3.0 Specification is available to the public by request at www.uciexpress.org/specifications.
Learn more about the UCIe 3.0 Specification at the Future of Memory and Storage (FMS)
Swadesh Choudhary, UCIe Consortium, will introduce new features included in the UCIe 3.0 Specification at FMS on Thursday, August 7, 2025, from 8:30 – 9:35 am PT in the Santa Clara Convention Center. The UCIe Consortium will also host a kiosk in the FMS Open Standards Pavilion (BOOTH 725) on the exhibit show floor from August 5-7. Visit the FMS agenda for detailed information about the UCIe Consortium’s presentation and exhibit schedule: https://futurememorystorage.com/.
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About UCIe Consortium
The UCIe Consortium is an industry consortium dedicated to advancing UCIe™ (Universal Chiplet Interconnect Express™) technology, an open industry standard that defines the interconnect between chiplets within a package, enabling an open chiplet ecosystem and ubiquitous interconnect at the package level. UCIe Consortium is led by key industry leaders Advanced Semiconductor Engineering, Inc. (ASE), Alibaba, AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, NVIDIA, Qualcomm Incorporated, Samsung Electronics, and Taiwan Semiconductor Manufacturing Company, and represents more than 150 member companies. For more information, visit www.UCIexpress.org.