Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
November 11, 2026 -
SEOUL, South Korea – QUALITAS SEMICONDUCTOR CO., LTD. (hereinafter referred to as "Qualitas") (KOSDAQ: 432720), a leading provider of high-speed interface IP solutions, announced its collaboration with Mobilint, a Korean AI semiconductor company, to support the development of NPU-based AI SoCs through integrated high-speed interface IP solutions.
Qualitas is supplying multiple high-speed interface IPs as an integrated solution for an AI SoC featuring a high-performance neural processing unit (NPU) being developed by Mobilint. The solution includes a chiplet solution for high-speed chiplet-to-chiplet connectivity and a PCIe Subsystem for high-bandwidth data transfer with external devices. It also incorporates a MIPI Subsystem for camera data input/output and display output, supporting the AI SoC’s diverse data connectivity requirements.
Integrating multiple high-speed interfaces on a single chip at advanced process nodes presents significant design challenges. It requires expertise in core technologies such as equalization, which compensates for signal distortion, and clock and data recovery (CDR), as well as a deep understanding of process design kits (PDKs) and power, performance, and area (PPA) optimization. In particular, the chiplet solution supplied for this project was designed to accommodate heterogeneous UCIe connectivity between dies with different architectures, enhancing flexibility and scalability in chiplet-based AI SoC designs.
By providing integrated subsystem solutions spanning PHYs and controllers, Qualitas has helped substantially reduce the customer’s system design complexity and accelerate time-to-market.
The rapid growth of Physical AI—AI that interacts with the physical world through applications such as robotics and autonomous driving—is driving demand for high-bandwidth interfaces in NPU-based AI SoCs that perform real-time processing. Robots must process data from multiple cameras and sensors with minimal latency, making high-speed chiplet interconnects and high-performance vision interfaces key factors in product competitiveness.
Ensuring that multiple interface IPs operate together on a single chip without interference requires both strong individual IP performance and comprehensive integration verification capabilities. Qualitas Semiconductor has met these requirements by drawing on verification expertise accumulated across numerous projects.
Few companies in Korea provide such a comprehensive range of high-speed interfaces for a single SoC, covering chiplet-to-chiplet interconnects, high-speed data transfer with external devices, and camera vision interfaces. This design win in an advanced-node, high-performance AI SoC project targeting mass production is expected to serve as a strong technical reference as Qualitas Semiconductor expands its presence in the global AI SoC market.
“This collaboration is a meaningful achievement that demonstrates the global competitiveness of our broad high-speed interface IP portfolio at advanced process nodes,” said Duho Kim, CEO of Qualitas. “As the market for NPU-based AI SoCs expands rapidly in the Physical AI era, we will accelerate our efforts to address next-generation, high-value markets, including robotics and Edge AI, with our differentiated integrated IP solutions.”
About Qualitas Semiconductor
Qualitas Semiconductor is a specialized provider of ultra-high-speed interface semiconductor IP, offering high-value IP solutions—including PCIe Gen6, UCIe 2.0, and MIPI—that have been silicon-proven on advanced process nodes. Leveraging our expertise in interconnect, SerDes, and DSP technologies along with robust IP development capabilities, we enable leading fabless companies worldwide to develop SoCs for 5G, AI, autonomous driving, IoT, and mobile applications quickly and efficiently.