Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
July 9, 2026 -
By JEONG IL JOO, thelec.net
Samsung Electronics has delayed the mass production schedule for its Compute Express Link (CXL) 3.1-based memory module, the CMM-D 3.0, as launches of CXL 3.1-compatible central processing units (CPUs) from Intel and Advanced Micro Devices have been pushed back.
According to industry sources on July 6, Samsung Electronics will continue producing its CXL 2.0-based CMM-D 2.0 memory modules for the time being. The company had originally planned to manufacture customer samples of the CMM-D 3.0 in June, but that schedule has now been postponed.