Scalable Network Interconnect IP Core Addresses Growing On-Chip Communication Challenges in Next-Generation SoCs

July 27, 2026 -

Scalable Network Interconnect IP Core Addresses Growing On-Chip Communication Challenges in Next-Generation SoCs

Long Beach, California — As modern semiconductor devices integrate hundreds of processing elements, accelerators, memory subsystems and high-speed interfaces, the efficiency of the on-chip communication fabric has become a defining factor in overall SoC performance. Traditional shared-bus and crossbar architectures increasingly struggle to satisfy the bandwidth, latency and physical implementation demands of AI, automotive, networking and high-performance computing applications.

To address these challenges, T2M is introducing its partner’s silicon-proven Network Interconnect IP Core, providing semiconductor companies with a scalable Network-on-Chip (NoC) solution that simplifies complex SoC communication while improving implementation efficiency.

Unlike conventional interconnect architectures that rely on centralised switching resources, the distributed Network Interconnect architecture enables independent optimisation of communication paths, allowing designers to balance bandwidth, latency, power consumption and silicon area according to the specific needs of each subsystem. The modular architecture also provides greater flexibility during physical implementation by reducing routing congestion and simplifying floor planning in increasingly complex designs.

This IP Core supports industry-standard AXI4 and ACE-Lite protocols, making integration straightforward for existing AMBA-based systems while allowing designers to scale from cost-sensitive embedded devices to multi-billion transistor application processors. Integrated configuration management, safety mechanisms, debug infrastructure and transaction monitoring further reduce development effort and improve system reliability throughout the product lifecycle.

Today's SoCs demand far more than simple data movement. "Design teams require an interconnect architecture capable of scaling with increasing compute density while maintaining implementation efficiency and predictable performance. Our partner’s Network Interconnect IP provides a proven communication backbone that enables customers to accelerate development of next-generation silicon with lower design risk and greater architectural flexibility."

The Network Interconnect IP Core is available in a white-box licensing model with comprehensive technical support, integration assistance and flexible pricing, enabling customers to rapidly deploy production-ready NoC technology into AI accelerators, automotive processors, networking devices, industrial controllers and advanced multimedia SoCs.

Meet T2M at DAC 2026

T2M will showcase its latest portfolio of Interface, Analog, Wireless, Cellular and Foundation IP solutions during DAC 2026, taking place July 26–29 at the Long Beach Convention Center, California. Visitors are invited to meet the T2M business teams to discuss Network Interconnect IP, UCIe, DDR5/LPDDR5, MIPI A-PHY, SerDes and other advanced semiconductor IP Cores. For more information on licensing options and pricing, please drop a request: contact@t-2-m.com