Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
August 3, 2026 -
As the automotive industry moves toward software-defined vehicles, the need for open, scalable, and secure computing platforms has never been greater. Developing these platforms requires collaboration across the semiconductor ecosystem, bringing together expertise in processor architectures, AI acceleration, interconnects, memory systems, software tools, and system integration.
That collaborative approach is at the heart of RIGOLETTO, one of several European research and innovation projects in which Arteris is proud to participate.
On July 7-8, Arteris was represented by Emmanuel Vaumorin at the RIGOLETTO General Assembly in Herzogenaurach, Germany, where consortium members celebrated the successful completion of the project’s first year and aligned on the next phase of development.
Supported by the Chips Joint Undertaking, RIGOLETTO brings together 64 leading European semiconductor companies and research organizations from 15 European and associated countries to develop a next-generation automotive hardware platform based on the RISC-V instruction set architecture. The project spans the technologies required to build future software-defined vehicles, including processor cores, AI accelerators, interconnects, memory hierarchies, peripheral subsystems, and software development tools.
For Arteris, participation in RIGOLETTO reflects a broader commitment to advancing semiconductor innovation through collaborative research. Across multiple European initiatives, Arteris contributes expertise in high-performance, safety-compliant Network-on-Chip (NoC) IP technology, heterogeneous IP interconnects, RISC-V integration, secure on-chip communication, hardware and software information integration automation including at the hardware-software interface, and the definition and prototyping of next-generation automotive computing platforms.
As vehicle architectures become increasingly centralized and software-driven, efficient communication between compute elements is becoming just as important as the compute itself. High-performance interconnect technologies play a critical role in enabling the scalability, safety, and determinism required for next-generation automotive systems, whether those are chiplets, SoCs, or high-end MCUs.