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System on Chip design resources
System on Chip design resources
September 3, 2026 -
By Selye Moon, thelec.net
Samsung Electronics unveiled a strategy to overcome memory technology limits in the artificial intelligence (AI) era. At its core is an architecture that vertically stacks memory and computing devices to sharply increase capacity within the same footprint while shortening data-transfer distances. The company is developing its proprietary zHBM and zNAND-O technologies following HBM5.
Choi Jang-seok, executive vice president and head of product planning for Samsung Electronics' Memory Business, presented the company's "CUBE" strategy during a keynote at the Memory Executive Summit at SEMICON Taiwan 2026 in Taipei on Sept. 1. CUBE stands for Capacity, Utilization, Bandwidth and Efficiency.