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System on Chip design resources
System on Chip design resources
November 9, 2026 -
By Frontier India News Network
Russia is developing its own chiplet technology as it seeks to overcome semiconductor manufacturing restrictions, with a new tensor chiplet, a 112 Gbps interconnect roadmap, and advanced packaging technologies. A new national standards initiative could bring Russian semiconductor developers together to build next-generation processors and AI accelerators
Russia is currently in the process of establishing a domestic technological framework for chiplet-based microelectronics. The objective is to address the constraints associated with advanced semiconductor manufacturing by using heterogeneous integration. The nation is establishing the groundwork for a new era of specialized computing systems and processors, with developments that include a registered tensor chiplet design and high-speed interconnect technologies that can achieve 112 Gbps.
In October 2026, the establishment of a Chiplets Working Group under Technical Committee 167 was a major milestone in the process of standardizing the technology. Russia is currently in the process of establishing its own ecosystem of chiplet designs, packaging technologies, and interconnect standards, while the United States and China are already implementing increasingly sophisticated multi-die architectures.