Fraunhofer IPMS advances chiplet integration and low-power memory

November 9, 2026 -

By Asma Adhimi

Fraunhofer IPMS will showcase new semiconductor technologies at SEMICON Europa 2026 in Munich, highlighting advances in chiplet integration, photonics and energy-efficient memory. The developments aim to improve system performance while reducing power consumption and supporting more flexible chip manufacturing.

For European semiconductor companies, the work offers new opportunities to combine specialized chip technologies and access industry-oriented pilot lines. It also highlights how EU-backed research infrastructure can help bridge the gap between laboratory developments and commercial manufacturing.

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