IBM, Samsung Unveil VTFET to Extend Moore's Law
By Stefani Munoz, EETimes (December 14, 2021)
IBM and Samsung Electronics claimed a breakthrough in semiconductor design based on a new IBM’s architecture touted as enabling an 85-percent reduction in power consumption.
The partners said the Vertical Transport Field-Effect Transistors (VTFET) scheme offers greater power efficiency over FinFET designs, potentially extending Moore’s Law scaling beyond current two-dimensional nanosheet thresholds.
FinFETs are generally designed to lie flat atop a wafer to allow electric currents to flow horizontally. Compared to a planar transistor, FinFETs help reduce power leakage while providing greater device density.
Unlike FinFETs, the companies said VTFETs are situated perpendicular to a chip substrate, allowing electric currents to flow vertically. The companies claim the design could, for example, extend smartphone battery life beyond a week without requiring a charge, according to IBM’s blog post.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Oxygen Layer May Extend Moore's Law
- Samsung Wants Moore's Law End, Analyst Says
- FeFET to Extend Moore's Law
- IBM, Chartered and Samsung Extend Integrated DFM Support for Common Platform Technology to 45nm
- IBM, Chartered and Samsung Extend Common Design Enablement Platform for 65-Nanometer Base and Low-Power Processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation