Samsung’s 2nm Advance Draws on EDA Innovation from Cadence, Siemens, and Synopsys

June 8, 2026 -

By Brendan Burke, Futurum

Synopsys, Cadence, and Siemens simultaneously announced expanded certified design flows, IP portfolios, and AI-driven capabilities on Samsung Foundry’s 2nm class processes at SAFE Forum 2026. The triple announcement reveals how Samsung’s foundry renaissance creates growth vectors for three EDA ecosystems.

What is Covered in This Article:

• Synopsys, Cadence, and Siemens release competing Samsung 2nm certifications simultaneously
• Samsung’s foundry momentum from NVIDIA Groq 3, AMD HBM4, and Tesla AI5 engagements
• Diverging differentiation across multiphysics, NVLink-C2C IP, and photonics verification
• AI-driven design automation approaches from both vendors on Samsung’s platform
• Advanced packaging approaches across all three vendors for multi-die AI silicon

Synopsys announced at Samsung Advanced Foundry Ecosystem (SAFE) Forum 2026 on May 28, 2026, production-ready AI-powered digital and analog design flows for Samsung’s third-generation 2nm class process, expanded certified interface IP, silicon-based test capabilities delivering up to 20% test efficiency improvements through TestMAX with AI-assisted ATPG, and new multiphysics signoff solutions including PrimeShield Process Sensitivity Analysis and Totem-SC electromigration and IR drop analysis certified on second-generation 2nm and 4nm class processes. Synopsys also validated its 3DIC Compiler on Samsung’s Hybrid Copper Bonding 3D test chip and expanded its IP portfolio spanning UCIe, PCIe 7.0, 112G/224G, LPDDR6, and DDR5 MRDIMM Gen2 across processes from 14nm through second-generation 2nm.

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