Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern
Kaiserslautern, Germany, January 08, 2024 – Creonic GmbH is pleased to announce its official membership as a supporting partner of the Science and Innovation Alliance Kaiserslautern (SIAK). This collaboration underlines Creonic's commitment to fostering innovation and scientific progress within the region.
SIAK is a consortium of leading companies, research institutions, and educational establishments in Kaiserslautern, focused on enhancing collaboration between industry and academia. As a supporting member, Creonic will actively participate in initiatives aimed at supporting technology transfer and innovation in the region.
"Becoming a member of the Science and Innovation Alliance Kaiserslautern strengthens our ties to the local science and technology community," declared Timo Lehnigk-Emden, CEO of Creonic GmbH. "We look forward to working together on projects that have the potential to shape the technology landscape in our region sustainably."
This partnership provides Creonic with the opportunity to share its expertise and resources with other SIAK members and collaboratively develop innovative solutions. By working closely with research institutions and companies in Kaiserslautern, Creonic aims to contribute to strengthening the regional innovation ecosystem.
Creonic GmbH is eager to collaborate with SIAK and believes that this partnership will contribute significantly to boosting the region's innovation capabilities and competitiveness.
|
Creonic Hot IP
Related News
- SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
- Cortus joins the Alliance for Internet of Things Innovation (AIOTI)
- Creonic GmbH joins NewSpace Initiative
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |