Logic Design Solutions launches Gen4 NVMe host IP
France, Gournay sur Marne --November 4 2024 – The Gen4 NVME-HOST-IP on Artix Ultra Scale Plus of Logic Design Solutions is now available.
It enables random access, sequential access and multi-user access.
FAT32/EXFAT file system working in RAID0 is available as an option.
To show these features, several demos, from which customers can re-use to start their project, are ready to use :
- Sequential access with one disk with or without FAT32/EXFAT.
- Random access evaluation.
- Simultaneous write access and read access (Multi users).
- CPU (C Source code provided) or State Machine (VHDL provided) Demo.
All of these features in one single IP at PCIe Gen4 speed !
|
Logic Design Solutions Hot IP
Related News
- Logic Design Solutions launches an EXFAT IP Soft Core for NVMe Host
- Logic Design Solutions launches a new version of its NVMe HOST IP Targeting embedded recorder systems
- Logic Design Solutions Launches NVME Host IP on Xilinx Ultrascale & Ultrascale Plus FPGA
- Logic Design Solutions Introduces the first NVMe HOST IP on POLARFIRE SoC FPGA
- Logic Design Solutions Introduces the first NVMe Host IP on PolarFire FPGA
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |