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Silicon on Chip design resources
Silicon on Chip design resources
TSMC said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon...
www.eetasia.com, Feb. 18, 2021 –
Taiwan Semiconductor Manufacturing Co. (TSMC) said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon.
In a Feb. 9 board meeting, the world's largest chip foundry approved the issuance of corporate bonds in Taiwan for as much as NT$120 billion (approximately $4.4 billion) and provided a guarantee to subsidiary TSMC Global to issue US dollar-denominated corporate bonds for up to $4.5 billion that would fund capacity expansion as well as pollution-prevention measures.
In the board meeting, TSMC also approved the establishment of a wholly owned subsidiary in Japan to expand research on materials for three-dimensional chips, with a paid-in capital of up to $18.6 billion (approximately $186 million). The announcement follows anunconfirmed report that TSMC plans to open its first overseas chip-packaging facility in Japan.