VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices
SAN JOSE, Calif.-- January 08, 2019 -- Today at the 2019 Consumer Electronics Show VeriSilicon announces the extension of its collaboration with NXP® Semiconductors N.V. (NASDAQ:NXPI) to machine learning. NXP’s upcoming i.MX products will include VeriSilicon’s Vivante intelligent pixel processing IP solution centered around the VIP Neural Network Processor Unit.
VeriSilicon Vivante VIP NPU features full scalability from extremely low power sub TOPS to high performance exceeding 100 TOPS. Vivante VIP8000/VIPNano NPU IP has been powering next-generation Intelligent devices across multiple market segments such as smart home, industrial, mobile, and automotive ADAS.
Vivante VIP processor supports the OpenCL 1.2 FP and OpenVX 1.2 APIs and common AI frameworks with a full software suite, including SDKs. All Vivante VIP configurations share a common unified software stack that has been deployed in products in multiple market segments.
“VeriSilicon’s Vivante VIP IP family NPU’s architecture has full scalability to address AI Everywhere, from battery operated OS-Less, DDR-Less devices to high performance Neural Network processors in Edge Server applications with a common SDK and unified software. We are honored to have NXP as a technology partner to address key market segments with Machine Learning technology. Vivante VIP IP is a leader in the NPU IP market with multiple products in the marketplace and solutions for each of the key market segments,” said Weijin Dai, executive vice president and general manager of the Intellectual Property Division at VeriSilicon. “Continuing with our long-term technology partnerships with NXP, this engagement adopted the full Vivante Intelligent Pixel Processing Solution, which includes NPU, ISP, GPU, and Video IP.”
“NXP’s vision is machine learning everywhere. VeriSilicon Vivante VIP architecture matches our vision,” said Martyn Humphries , vice president and general manager of i.MX applications processors at NXP. “These production-proven machine learning IP’s together with our machine learning eIQ tools enable us to rapidly develop and deploy cloud-to-edge solutions.”
VeriSilicon at CES
VeriSilicon will host technology demonstrations, including AI-Compute and NPU technology, at CES2019 in the Westgate Hospitality Suites. Contact us at CES2019@verisilicon.com for more information.
About VeriSilicon
VeriSilicon is a Silicon Platform as a Service (SiPaaS®) company that provides world class SoC and SiP solutions and a leading IP provider with the most comprehensive IP portfolios address markets including mobile internet devices, datacenters, the Internet of Things (IoT), automotive, industrial, and medical electronics.
Our turnkey service takes from concept to a completed, tested and packaged chip in record time as performance effective and cost-efficient service for customers including both emerging and established companies, OEMs, ODMs, and large internet/cloud platform companies.
VeriSilicon’s Vivante® scalable intelligent pixel processing IPs from camera-in to display-out complete solutions include ISP, NPU, GPU and GPGPU, Hantro® video codec, and display controller, which deliver highly differentiated PPA and QOR on the devices, at the edge, and in the cloud. VeriSilicon’s scalable ZSP® based solutions widely applied in HD audio/voice and BLE5.0, Wi-Fi, and NB-IoT.
Founded in 2001 and head-quartered in Shanghai, China, VeriSilicon has over 700 employees with 5 R&D centers in US and in China and 10 sales offices worldwide.
|
Verisilicon, Inc. Hot IP
Related News
- Xilinx Expands into Wide Range of Vision-Guided Machine Learning Applications with reVISION
- NXP and Qualcomm Collaborate to Accelerate Adoption of NFC and Security in Mobile, Wearable and Internet of Things Devices
- SD 5.1/eMMC 5.1 Host and Device Controllers with Matching PHYs for all kind of Portable Memory Storage Devices, making it easy to integrate a wide range of Applications in your products
- Synopsys and SiMa.ai Collaborate to Bring Machine Learning Inference at Scale to the Embedded Edge
- GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |