Wi-Fi 6 (ax)+BLEv5.4+15.4 Dual Band RF IP for High-End Applications.
Creonic GmbH joins NewSpace Initiative
Kaiserslautern, Germany -- May 10, 2022 – Creonic GmbH recently joined the NewSpace Initiative launched by the BDI (Bundesverband der Deutschen Industrie). BDI is a network of German companies that are active in the NewSpace segment.
About the NewSpace Initiative
Private companies in the German space sector have joined forces in the NewSpace Initiative. Innovations in space travel are increasingly in the hands of private companies. This circumstance is revolutionizing a sector in which, for a long time, only states and their space agencies were active. The commercialization of space travel is also a huge opportunity for German companies. NewSpace can democratize access to space technologies by, among other things, enabling participating companies to provide data for the necessary digital services from space. To bundle competencies and create synergies, the BDI has launched the NewSpace Initiative. It sends a strong signal to the German and European space industry: We are on the move together and are driving space innovations forward.
About Creonic GmbH
Creonic GmbH is based in Kaiserslautern, Germany, develops microchips, components and algorithms for modems, data centers and satellites. In the information age, such elements are becoming increasingly important. Creonic specializes in storing and transporting enormous amounts of data. Today, transmission is often satellite-based, which is where Creonic’s products are used. With Creonic’s chip designs, companies from start-ups to global corporations can develop their infrastructure.
For more information please visit our website at www.creonic.com.
|
Creonic Hot IP
Related News
- Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern
- Creonic GmbH Introduces Fast Fourier Transform IP Core
- Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity
- Real Intent Joins DARPA Toolbox Initiative to Provide Mil/Aero/Defense Grade Static Sign-Off
- Creonic GmbH is Heavily Invested in the Expansion and Research of 6G Technologies
Breaking News
- Weebit Nano and DB HiTek to demonstrate chips integrating Weebit ReRAM at PCIM 2025
- Silvaco Expands Product Offerings in Photonics and Wafer-Scale Plasma Modeling for AI Applications with Acquisition of Tech-X Corporation
- IC'Alps joins Intel Foundry Accelerator program as Value Chain Alliance (VCA) and Design Services Alliance (DSA) partner
- Movellus Debuts Industry-First On-Die Power Delivery Network Analyzer
- Weebit Nano Q3 FY25 Quarterly Activities Report
Most Popular
- Movellus Debuts Industry-First On-Die Power Delivery Network Analyzer
- Intel Foundry Gathers Customers and Partners, Outlines Priorities
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- CFX 0.13µm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |