SkyWater CEO Expands "Technology Foundry" Model
By Alan Patterson, EETimes (November 22, 2022)
SkyWater Technology CEO Thomas Sonderman is building a new type of chip foundry that shifts onerous multi-billion–dollar fab investments to customers who bear most of the cost.
The only 100% U.S.-owned foundry was created in 2017 after private equity investor Oxbow Industries acquired Cypress Foundry Solutions, a subsidiary of now-defunct Cypress Semiconductor, and installed former AMD executive Sonderman at the helm of the new company.
By creating a “technology-foundry model, we went after this sweet spot of the customization/volume gap that required a lot of innovation,” Sonderman told EE Times in an exclusive interview. “It also allowed us to market ourselves as different than just another specialty foundry.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab
- SkyWater Technology Expands Borrowing Capacity by Closing New $100 Million Senior Secured Revolving Credit Facility
- Fabless IC Company Sales "Shine" While IDM IC Sales "Slump" in 2012
- Foundries not dead, just evolving, says Globalfoundries CEO
- Intel's New CEO Called "Strong Choice" to Respin Company
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications