GUC Monthly Sales Report - December 2024
Hsinchu, Taiwan -- Jan. 6th, 2025 - GUC (TAIEX: 3443) today announced its net sales for Dec. 2024 were NT2,702 million, increased 47.1% month-overmonth and also increased 22.4% year-over-year.
Net sales for fourth quarter in 2024 totaled NT$6,022 million, decreased 8.9% compared to third quarter in 2024 and also decreased 4.6% compared to the same period in 2023.
Net sales for 2024 totaled NT$25,044 million, decreased 4.6% compared to 2023.
GUC Sales Report:
(NT$ thousand)
Net Sales | 2024 | 2023 | MoM (%) | YoY (%) |
Dec. | 2,702,478 | 2,208,208 | 47.1% | 22.4% |
Year to Date | 25,044,192 | 26,240,714 | N/A | -4.6% |
Note: Year 2024 figures have not been audited.
GUC Dec. 2024 Sales Breakdown:
(NT$ thousand)
Product Items | Net Sales | % |
Turnkey | 1,834,310 | 68 |
NRE | 847,088 | 31 |
Others | 21,080 | 1 |
Total | 2,702,478 | 100 |
Note: Year 2024 figures have not been audited.
About GUC
GLOBAL UNICHIP CORP. (GUC) is the Advanced ASIC LeaderTM whose customers target IC devices to leading edge computing, communications, and consumer applications. Based in Hsin-chu, Taiwan GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, Vietnam and North America. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. For more information, please visit GUC’s company website (http:// www.guc-asic.com) for details.
|
Related News
Breaking News
- Weebit Nano Q3 FY25 Quarterly Activities Report
- Codasip launches complete exploration platform to accelerate CHERI adoption
- VSORA Raises $46 Million to Bring World's Most Powerful AI Inference Chip to Market
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
Most Popular
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- CFX 0.13μm eFuse OTP IP has been applied in the mass production of over 15,000 CMOS image sensors
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |