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Blogs
Interface IP: The Keystone for 3D Multi-Die Designs
(Monday, April 20, 2026)
Rambus DDR5 RDIMM 8000 Chipset Named Semiconductor Product of the Year from the Data Breakthrough Award
(Monday, April 20, 2026)
How GlobalFoundries is manufacturing quantum at scale
(Monday, April 20, 2026)
Why Security Can't Exist Without Trust
(Thursday, April 16, 2026)
Topology and Data Movement in Multi-Die Design
(Thursday, April 16, 2026)
Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI
(Thursday, April 16, 2026)
Google, Quantum Attacks, and ECDSA: Why There’s No Need to Panic and Why Preparation Matters Now
(Thursday, April 9, 2026)
Powering AI at scale: How HVDC and GaN are transforming hyperscale data centers
(Thursday, April 9, 2026)
Rethinking Verification: Why Functional and Formal Methods must coexist in VLSI?
(Thursday, April 9, 2026)
From AI Factories to Molecular Discovery
(Monday, April 6, 2026)
The 5 Biggest Challenges in Modern SoC Design (And How to Solve Them)
(Monday, April 6, 2026)
Securing SoC Reliability with Precision Power-On Reset IP for 0.8V Industrial Designs
(Monday, March 30, 2026)
Satellite communications are no longer as secure as assumed
(Monday, March 30, 2026)
Why Post-Quantum Cryptography Doesn’t Replace Classical Cryptography
(Monday, March 30, 2026)
Advancing In-Memory Computing: A Global Effort to Build More Efficient AI Hardware
(Monday, March 30, 2026)
Accelerating Next-Generation EMIB-T Packaging: A Collaboration Between Synopsys and Intel Foundry
(Monday, March 30, 2026)
The Architectural Evolution of 16GHz PLLs for Next-Gen AI and SerDes SoCs
(Thursday, March 26, 2026)
ISE 2026 Recap: IntoPIX Showcases IPMX, JPEG XS, 8K And AI-Powered Workflows
(Monday, March 23, 2026)
ChiPy®: Bridge Neural Networks and C++ on Silicon — Full Inference Pipelines with Zero CPU Round-Trips
(Monday, March 23, 2026)
Chiplet innovation isn’t waiting for perfect standards
(Thursday, March 19, 2026)
Powering the AI Supercycle: Design for AI and AI for Design
(Monday, March 16, 2026)
Advancing High‑Performance Silicon Photonics and Silicon Germanium (SiGe) for the Next Era of Optical Connectivity
(Monday, March 16, 2026)
Synopsys Delivers First Complete UFS 5.0 and M‑PHY v6.0 IP Solution for Next‑Gen Storage
(Thursday, March 12, 2026)
Flexible Ethernet IP Licensing for Secure, Scalable Silicon Development
(Tuesday, March 10, 2026)
Transforming the Automotive Experience with Cadence Tensilica DSPs
(Monday, March 9, 2026)
Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design
(Monday, March 9, 2026)
Accelerating Chiplet Innovation with a New Partner Ecosystem
(Monday, March 9, 2026)
From Fab to the Field: Accelerating Trusted U.S. Semiconductor Onshoring for Mission-Critical Defense
(Monday, March 9, 2026)
IC Manufacturing and Packaging: The Engine Powering the Digital and AI World
(Friday, March 6, 2026)
Working in electronics engineering
(Thursday, March 5, 2026)
Intelligently Assembling SoCs the Agnisys Way
(Thursday, March 5, 2026)
Akida Pico: The Tiny Brain Making “Always-On” AI a Reality
(Thursday, February 26, 2026)
Bridging the Gap to Chiplet Interoperability
(Thursday, February 26, 2026)
Rambus Announces Industry-Leading Ultra Ethernet Security IP Solutions for AI and HPC
(Monday, February 23, 2026)
AI is stress-testing processor architectures and RISC-V fits the moment
(Monday, February 23, 2026)
How Analogix utilized Solido SPICE to overcome verification challenges in creating high-quality PLLs
(Monday, February 23, 2026)
Accelerating Chiplet Interoperability
(Monday, February 23, 2026)
Data Center Digital Twins: How Simulation Improves Design and Performance
(Monday, February 23, 2026)
Cadence Tapes Out 32GT/s UCIe IP Subsystem on Samsung 4nm Technology
(Thursday, February 19, 2026)
Advancing Technology Nodes: The Era of Divergent Scaling
(Monday, February 16, 2026)
Powering the Physical AI Era: How GlobalFoundries Enables Real-Time Machines That Sense, Think, Act, and Communicate
(Monday, February 16, 2026)
Compartmentalisation by Microservices
(Thursday, February 12, 2026)
Stellar P3E, 1st automotive MCU with an Neural-ART and the beginning of the democratization of AI in cars
(Thursday, February 12, 2026)
Silicon as strategy: the hidden battleground of the new space race
(Wednesday, February 11, 2026)
DEEPX, Rambus, and Samsung Foundry Collaborate to Enable Efficient Edge Inferencing Applications
(Wednesday, February 11, 2026)
An Effective SRAM Repair Strategy Based on eMemory NeoFuse OTP and Siemens Tessent™ MemoryBIST
(Wednesday, February 11, 2026)
Transforming Chaos Into Clarity: Keysight Data Management for the AI Era
(Monday, February 9, 2026)
Five Reasons You Should Start Your Chip Design with IDesignSpec
(Wednesday, February 4, 2026)
UCIe D2D Adapter Explained: Architecture, Flit Mapping, Reliability, and Protocol Multiplexing
(Wednesday, February 4, 2026)
Sensor fusion in action: How cameras and LiDAR integrate with radar for safer driving
(Monday, February 2, 2026)
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