June 15, 2026 -
By Jay Qian
TradingKey - On June 8, Seoul time, Jun Young-hyun, head of Samsung Electronics' chip division, stated that the company has held extensive discussions with NVIDIA ( NVDA) CEO Jensen Huang regarding foundry cooperation for next-generation chips and future technologies such as HBM4E and HBM5. The two sides are collaborating on autonomous driving chips for 4nm and 8nm nodes, as well as NVIDIA's accelerator chip segment.
Just before the meeting, NVIDIA confirmed that the three memory giants—Samsung Electronics, SK Hynix, and Micron ( MU) Technology—have all passed HBM4 qualification and entered the mass production phase, and will supply HBM4 for NVIDIA's next-generation AI platform, Vera Rubin. Vera Rubin is now in full production, with deliveries scheduled to begin in the third quarter of this year.