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System on Chip design resources
System on Chip design resources
June 23, 2026 -
Seoul, South -- BOS Semiconductors, the only Korean fabless semiconductor company selected as one of the 11 global startups in the Physical AI category of CB Insights' AI 100 2026, announced that it will participate in electronica Shanghai 2026, Asia's largest electronics industry exhibition, to be held from July 1 to 3 at the Shanghai New International Expo Centre (SNIEC) in China.
electronica Shanghai 2026 is one of Asia's leading trade fairs, showcasing the latest technologies and market trends across the electronics industry, including semiconductors, electronic components, embedded systems, automotive electronics, and artificial intelligence (AI). The event brings together global semiconductor companies, automakers, and technology leaders to unveil innovations and explore future business opportunities.
At this year's exhibition, BOS will showcase its next-generation AI semiconductor technologies designed for the Physical AI era, spanning autonomous driving, robotics, and intelligent mobility applications.
The AI industry is rapidly evolving beyond Large Language Models (LLMs) and Vision Language Models (VLMs) toward Physical AI systems capable of perceiving, reasoning, and acting in the real world. At the core of this transition is the Vision-Language-Action (VLA) model, which integrates perception, reasoning, and action into a unified AI pipeline, enabling vehicles and robots to autonomously understand, decide, and interact with complex environments. Unlike traditional AI workloads, VLA models require real-time responsiveness at the millisecond level, high accuracy, and robust control capabilities, creating demand for a new generation of AI computing platforms.
To address these emerging requirements, BOS has developed AI semiconductors optimized for VLA-based Physical AI systems and is actively advancing its next-generation product roadmap. The company is focused on enhancing ultra-low-latency inference performance, high model accuracy, and seamless sensor-control integration to maximize the capabilities of Physical AI applications.
At its booth, BOS will demonstrate its high-performance AI accelerator, Eagle-N, designed to process diverse sensor data in real time and enable intelligent perception and decision-making for vehicles and robots. Eagle-N features a chiplet-based architecture that can be flexibly scaled according to customer requirements and product performance targets. By optimally combining functional chiplets, the platform delivers both high performance and power efficiency while reducing development time and improving cost competitiveness. It is specifically designed to efficiently handle the complex AI workloads required by Physical AI systems, making it well suited for next-generation autonomous vehicles, robotics, and intelligent machines.
Through its participation at electronica Shanghai 2026, BOS plans to actively engage with customers and partners from China and around the world, gaining deeper insights into market demands and expanding collaboration opportunities in the rapidly growing Physical AI ecosystem.
"Physical AI is emerging as a transformative technology that will reshape the automotive and robotics industries," said Jason Chae, Chief Sales & Marketing Officer and Executive Vice President at BOS. "Through this exhibition, we look forward to showcasing the competitiveness of our Eagle-N AI computing platform and expanding partnerships with global OEMs and Tier-1 suppliers, particularly in China."
BOS Semiconductors http://www.bos-semi.com