Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
July 7, 2026 -
T2M, a leading provider of high-performance semiconductor IP cores, today announced the availability of its partner’s advanced UCIe Die-to-Die Interface IP core, a scalable digital interconnect solution designed to accelerate the development of next-generation chiplet-based SoCs.
As heterogeneous integration and chiplet-based architectures become the preferred approach for building high-performance AI, HPC, networking, automotive, and data center devices, designers require flexible and scalable die-to-die connectivity solutions that reduce integration complexity while enabling faster time-to-market.
The IP core delivers up to 32 Gbps aggregate bandwidth per channel through a configurable 20-lane architecture while providing low-latency communication and efficient AXI-based integration into any SoC. Its technology-independent digital architecture enables easy migration across foundries and process nodes, making it an ideal solution for a wide range of semiconductor applications.
Key Features :
"Chiplet-based system design is rapidly transforming the semiconductor industry, creating a strong demand for flexible and reusable die-to-die interface solutions," said by T2M leadership. "Our partner’s UCIe Die-to-Die Interface IP core enables customers to accelerate chiplet integration with a scalable, technology-independent architecture that simplifies SoC development while delivering the performance required by next-generation applications."
The current implementation leverages a proven AIB 2.0-based digital architecture, providing customers with a robust foundation for chiplet connectivity while supporting the industry's transition toward standardized UCIe ecosystems.
T2M continues to expand its comprehensive Interface IP portfolio, which includes PCI Express®, CXL®, UCIe, USB, MIPI, Ethernet, DDR, LPDDR, and other high-speed interface solutions across multiple foundries and process technologies.
Visitors can learn more about T2M’s Interface IP portfolio and discuss their chiplet connectivity requirements during DAC 2026 in Long Beach, California.
About: T2M is a leading provider of silicon-proven semiconductor IP Cores, offering a broad portfolio of Interface, Memory, Security, Analog, Wireless, Cellular and Processor IP cores. Serving customers worldwide, T2M IP enables semiconductor companies to accelerate SoC development with high-quality, reusable IP Cores optimized for advanced technologies and emerging applications. For more information on licensing options and pricing, please drop a request: contact@t-2-m.com