NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum
Award-Winning Paper Features 5nm Node Enablement and Maximizing QoR With Synopsys Fusion Compiler RTL-to-GDSII Implementation System Solution
MOUNTAIN VIEW, Calif., Feb. 9, 2021-- Synopsys, Inc. (Nasdaq: SNPS) today announced it received the Customers' Choice Award for a technical paper presented at the TSMC 2020 North America Open Innovation Platform® (OIP) Ecosystem Forum. The paper, titled "5nm Node Enablement and Maximizing QoR Using Fusion Compiler™," was developed and presented by Henry Sheng, group director of Engineering at Synopsys. The paper won the award based on the popular vote by conference attendees and can be downloaded on TSMC.com.
"Our customers appreciate Synopsys sharing their technical knowledge and expertise in enabling the next-generation designs in fast-growing markets such as 5G, mobile and automotive," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "I'm pleased to congratulate Synopsys as the winner of the Customers' Choice Award and look forward to continuing our joint efforts to help our customers unleash silicon innovations with design solutions on TSMC's most advanced processes."
As the paper highlights, design optimization is impacted by the emerging physical complexity and needs to evolve for advanced nodes. With the goal of ensuring the fastest and most predictable time to results for TSMC advanced-node implementation, additional topics in the paper included new legalization and routing requirements, variant-awareness techniques, and how design teams can best leverage the Synopsys Fusion Compiler to achieve optimal levels of power, performance and area.
"Synopsys has partnered with TSMC for decades to accelerate silicon innovation and help customers achieve their complex design goals," said Sanjay Bali, vice president of Product Marketing, Digital Design Group at Synopsys. "We are honored to receive this prestigious award, as it recognizes Synopsys' commitment to the TSMC ecosystem and underscores our contribution to accelerate the development of best-in-class solutions. Innovative solutions, such as Fusion Compiler, enables our mutual customers to take advantage of TSMC's latest process technologies."
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the Silicon to Software™ partner for innovative companies developing the electronic products and software applications we rely on every day. As an S&P 500 company, Synopsys has a long history of being a global leader in electronic design automation (EDA) and semiconductor IP and offers the industry's broadest portfolio of application security testing tools and services. Whether you're a system-on-chip (SoC) designer creating advanced semiconductors, or a software developer writing more secure, high-quality code, Synopsys has the solutions needed to deliver innovative products. Learn more at www.synopsys.com.
|
Synopsys, Inc. Hot IP
Synopsys, Inc. Hot Verification IP
Related News
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum
- Open-Silicon Receives TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design
- Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |