Catalog of SIP Cores
System on Chip design resources
System on Chip design resources
June 15, 2026 -
TES Electronic Solutions GmbH offers two new voltage buffer IPs with driving capabilities up to 6 mA, built on X-FAB’s XT018-0.18µm BCD-on-SOI process and operate across a junction temperature range of -40°C to 150°C with a supply voltage of 3.2V to 3.4V. The following IPs are now available:
6 mA Unity Gain Buffer with 6.5 MHz Gain Bandwidth: TS_VBUFF_6mA_X8
300 μA Unity Gain Buffer with 5.5 MHz Gain Bandwidth: TS_VBUFF_300uA_X8
For more information on this and other IP solutions, visit the TES IP products page.
Contact
For inquiries, please email sales_dst@tes-dst.com
Visit our dedicated ASIC design service portal at https://asicentwicklung.de/ for further technical information and service details.
About TES
With over 20 years of experience in ASIC design and embedded graphics IP, TES is a one-stop partner for high-performance semiconductor solutions. Our IP portfolio includes highly customizable 2D, 2.5D, and 3D GPUs, display controllers, and a wide range of analog and digital IP blocks, ranging from SiGe RF to industrial ASIC solutions.
Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at www.tes-dst.com.