TES Electronic Solutions Introduces a Split‑Pi Boost‑Buck DC‑DC Converter IP for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.

July 6, 2026 -

TES Electronic Solutions GmbH announces the availability of its new DC-DC converter IP, TS_SPLITPI_3V3_X8, a cascaded 3.3 V boost‑buck converter that can be powered from either a 10 V - 30 V supply or a low-voltage backup battery and is implemented in X-FAB XT018 - 0.18µm BCD-on-SOI technology. The circuit implements the well‑known Split‑Pi topology, offering designers a simple way to achieve high efficiency and precise regulation.

The IP can be found here:

 DC-DC Split‑Pi Boost-Buck Converter, 10V up to 30V input voltage, 3.3V output voltage at   200/133mA load current.

Key Benefits

• Dual‑mode operation - Buck‑only when VIN > 10 V; boost‑buck from batteries as low as 1.9 V.
• Stable 3.3 V output with ±0.1 V accuracy for current loads up to 200 mA (buck) or 133 mA (boost‑buck).
• Variable‑frequency switching around 2 MHz.
• Robust protection - internal reverse polarity protection circuit and temperature monitoring improve reliability.
• Long lifetime - rated for 100000h of continuous operation.

TES will make supporting your design effort a priority - whether it is integrating this IP into your design or implementing a complete ASIC.

For more information on this and other IP solutions, visit the TES IP products page.

Contact

For inquiries, please email sales_dst@tes-dst.com

Visit our dedicated ASIC design service portal at https://asicentwicklung.de/ for further technical information and service details.

About TES

With over 20 years of experience in ASIC design and embedded graphics IP, TES is a one-stop partner for high-performance semiconductor solutions. Our IP portfolio includes highly customizable 2D, 2.5D, and 3D GPUs, display controllers, and a wide range of analog and digital IP blocks, ranging from SiGe RF to industrial ASIC solutions.

Headquartered near Stuttgart, Germany, TES Electronic Solutions GmbH serves a global customer base, with design operations in Stuttgart and graphics IP development in Hamburg. Learn more at www.tes-dst.com.