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Tuesday, December 9, 2025

• Silicon-Proven 16-bit 5MSps SAR ADC IP Cores Optimised for Automotive, Industrial, and IoT

Monday, December 8, 2025

• DVB-S2 Demodulator Available For Integration From Global IP Core
• Perceptia Announces Availability of Cryogenic 10-bit ADC and DAC IP in GF 22FDX
• SoftBank's Arm plans to set up chip training facility in South Korea
• Silicon’s Green Revolution: How Cutting-Edge Innovations are Forging a Sustainable Future for Semiconductors
• Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC
• First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry
• Global cybersecurity agencies publish secure AI integration principles for OT
• Nordic Semiconductor unveils nRF54LV10A - a breakthrough low-voltage Bluetooth LE SoC for next-gen healthcare wearables
• Ceva-XC21 Named "Best IP/Processor of the Year" at EE Awards Asia
• Innatera and 42T join forces to power the next wave of intelligent product innovation
• Risc-v Cores and Neuromorphic Arrays Enable Scalable Digital Processors for EdgeAI Applications
• CXL Adds Port Bundling to Quench AI Thirst
• UMC and Polar Collaborate to Meet Growing Demand for U.S. Onshore Semiconductor Manufacturing
• TSMC Strengthening Foundry 2.0 Leadership Amid Strong AI and Packaging Demand

Thursday, December 4, 2025

• MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC
• DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption
• Germany Redirects Intel Funds Into New Wave of Semiconductor Projects
• Could an EU Chips Act 2.0 Bridge the Lab-to-Fab Gap?
• BOS Semiconductors at 2025 Korea Tech Festival
• Fraunhofer HHI advances indium phosphide photonics for high-speed data communication
• Imec strengthens its global presence with new regional research & development hub in Qatar
• VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification
• The AI Future is Now All About the Edge
• Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development
• Idaho Scientific Selects QuickLogic eFPGA Hard IP to Enable Crypto Agility
• Open Chiplet Design Moves Forward with Tenstorrent’s OCA Plan
• From Launch to Leadership: The Microservice Store Nominated for TechWorks Cybersecurity Award

Wednesday, December 3, 2025

• Semidynamics Welcomes Iakovos Stamoulis as Chief Technology Officer
• Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels

Tuesday, December 2, 2025

• Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon
• NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design

Monday, December 1, 2025

• SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validation

Friday, November 28, 2025

• EU digital package promises €155B in savings with streamlined AI and data rules
• Sovereign AI: The New Foundation of National Power
• Intel Could Manufacture Apple M-Series Chips in 2027 with 18A-P Node

Thursday, November 27, 2025

• BOS Semiconductors Eyes Expansion into ‘Intelligent Space’ AI Market Beyond ADAS
• Edge AI’s Next Battlefield: Development Tools
• Tenstorrent QuietBox tested: A high-performance RISC-V AI workstation trapped in a software blackhole
• Finland: At the forefront of specialised microelectronics in Europe
• Sustainability moves upstream delivering greener semiconductor design
• Keysight Technologies Reports Fourth Quarter and Fiscal Year 2025 Results
• Europe tackles e-waste with eco-friendly innovation that helps reuse and repair
• Semiconductor supply risk management From firefighting to proactive strategy
• BKT Waluj Plant Wins CII National Water Award for 25% Water Reduction
• 6 IoT semiconductor predictions for 2026
• Codasip announces strategic licensing agreement with EnSilica for its CHERI-enabled embedded CPU from the 700 family
• Synopsys Demonstrates Framework for Optimizing Manufacturing Processes with Digital Twins at Microsoft Ignite
• InPsytech showcases 3nm UCIe 3.0 at OCP 2025, accelerating innovation in chiplet ecosystem
• RPI and GlobalFoundries Partner on Semiconductor Research, Education, and Workforce Development Initiatives
• TSMC to Build Three New 2 nm Fabs in Taiwan for $28 Billion
• Intel confirms steady 18A yield improvements and 14A progress