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Tuesday, June 3, 2025

• AccelerComm Secures $15m Funding to Speed Adoption of Technology for Space-Based 5G Networks to Deliver Universal Mobile Coverage

Monday, June 2, 2025

• Making Technology Real: GlobalFoundries' Vision for the Future
• HPC Innovator Taps Aion Silicon for $12M RISC-V Accelerator Program
• Chevin are proud to be awarded runner-up of Arm Silicon Startups Contest 2025
• 12-bit, 5MS/s SAR ADC IP Core for Ultra-Low Power Precision Applications: T2M Unveils New IP
• Siemens and IBM collaborate to bring SysML v2 model-based systems engineering to Siemens Xcelerator
• Metanoia Communications Selects Andes Technology RISC-V Processor to Boost 5G O-RAN Efficiency and Accelerate Development

Thursday, May 29, 2025

• SCI Semiconductor raises £2.5m to develop security-enhanced microcontroller based on CHERI
• 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
• TSMC to Open EU Design Center in Munich in Q3
• Synopsys Issues Statement in Connection with BIS Letter
• AI memory chip guru to unveil road map for next-generation HBMs

Wednesday, May 28, 2025

• Brite Semiconductor Releases TCAM IP based on 28HKC+ Process
• EnSilica Establishes New Engineering Hub in Cambridge
• TSMC to Open First European Design Center in Munich by Q3 2025, Focusing on AI and Automotive
• TSMC dazzles in Amsterdam
• SCI Semiconductor secures £2.5m towards developing CHERI-secured MCU
• ICTK Partners with BTQ of Canada for Quantum-safe Security Solutions
• Toward High-Density Embedded LiDAR for the Autonomous Vehicle of Tomorrow
• Ireland Maps Out 'Silicon Island' National Semiconductor Strategy
• Rapidus to assist training in Vietnam's semiconductor industry
• Arteris Bridges Hardware-Software Gap with New EDA Tool
• CEA Backs RISC-V for Sovereign, Scalable Computing
• Synopsys Posts Financial Results for Second Quarter Fiscal Year 2025
• Trump Blocks Chip Design Software Firms From Selling In China

Tuesday, May 27, 2025

• Imec's 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demonstrates record-low insertion loss at frequencies up to 325GHz
• Towards next-generation edge-AI technologies: EU consortium opens services to external customers
• Soitec reports fourth quarter revenue and Full-year results of fiscal year 2025
• Alphawave IP extends Qualcomm PUSU deadline for third time
• Imec ITF World 2025: The hardware horizon for AI
• Keysight Announces Executive Leadership Transitions and New Appointments

Monday, May 26, 2025

• CFX's 55nm BCD process OTP IP has been put on the shelves
• High-Performance USB 3.2 Gen1 & Gen2 PHY and Controller IP Cores from T2M, Powers Next-Gen SoCs
• RISC-V Turns 15 With Fast Global Adoption
• AMD sees TSMC as the clear favorite for 2nm, but Samsung remains in the game

Sunday, May 25, 2025

• Samsung to use Glass Substrate for Semiconductor manufacturing in 2028

Friday, May 23, 2025

• Smart Chips, Safe Trips: How DFT Powers the Future of Autonomy with Vijayaprabhuvel Rajavel
• Analogue Insight and Tetrivis Announce Joint Development of "Eurytion RFK1," a UCIe based 12nm Ka/Ku-Band RF Chiplet Transceiver
• Xiphera Wins ECSO STARtup Award 2025 for Innovation in Cybersecurity

Thursday, May 22, 2025

• Samsung Electronics Nears Decision on Foundry Business Separation
• Pioneering energy-efficient AI with innovative ferroelectric technology
• How Taiwan stays ahead in semiconductor race
• GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation
• SiFive Collaborates with Red Hat to Support Red Hat Enterprise Linux for RISC-V
• EnSilica expands satcoms user terminal portfolio with dual-beam, dual-polarization Ku-band analogue beamformer chipset