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Thursday, March 5, 2026

• QuickLogic Reports Fiscal Fourth Quarter and Full Year 2025 Financial Results
• Infineon and UMC partner in driving decarbonization across the supply chain
• ST technologies integrated into Qualcomm’s new Snapdragon Wear Elite platform
• Keysight and Qualcomm Advance RF Digital Twins to Scale Massive MIMO and AI-Native 6G Research
• Infineon expands DRIVECORE portfolio with three new software bundles, accelerating customer transition toward future RISC‑V automotive microcontrollers
• Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications
• Kudelski Labs Addresses Device Lifecycle Security, Edge AI, Post Quantum Cryptography and Regulatory Compliance at Embedded World 2026
• Keysight and Samsung Demonstrate End-to-End AI-RAN Validation Workflow with NVIDIA
• The Rise of RISC-V
• Samsung Ships Industry-First Commercial HBM4 With Ultimate Performance for AI Computing
• Rambus Sets New Benchmark for AI Memory Performance with Industry-Leading HBM4E Controller IP

Wednesday, March 4, 2026

• EU backs €1.1bn French cleantech manufacturing push
• Renesas Advances Its India and China Strategy with Strengthened Leadership
• STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere
• Innatera Selects Synopsys Simulation to Scale Brain-Inspired Processors for Edge Devices
• Ceva Launches PentaG-NTN™ 5G Advanced Modem IP, Enabling Satellite-Native Innovators to Rapidly Deploy Differentiated LEO User Terminals

Tuesday, March 3, 2026

• DCD-SEMI to Showcase CAN XL with Functional Safety and RISC-V Subsystems at Embedded World 2026 – Booth 4-481
• RISC-V IP Core, Powering Next-Gen Automotive & AI SoCs
• Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets

Monday, March 2, 2026

• Jmem Tek Joins the Intel Foundry Accelerator Ecosystem Alliance Program, Enabling JPUF and Post-Quantum Security Designs
• As AI scales, so do CPUs
• Synopsys Posts Financial Results for First Quarter Fiscal Year 2026
• Rapidus Secures 267.6 Billion Yen in Funding from Japan Government and Private Sector Companies
• BrainChip Named Official Technology Sponsor for Raytheon’s "Operation Touchdown" Autonomous Vehicle Competition
• Weebit Nano achieves record half-year revenue; licenses ReRAM to Tier-1 Texas Instruments
• MWC: Ericsson and Intel join for 6G AI-RAN
• Renesas Looks to the Future of Automotive With New Memory and SoC Tech
• Microservice Store Launches Security Support Partnership Program
• Samsung Electronics Announces Strategy To Transition Global Manufacturing Into ‘AI-Driven Factories’ by 2030
• TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.
• Siemens accelerates integrated circuit design and verification with agentic AI in Questa One
• ASML announces breakthrough in EUV light source to boost chip output
• TES offers new High-Speed Comparator IPs for X-FAB XT018 - 0.18µm BCD-on-SOI technology.

Friday, February 27, 2026

• TSMC Speeds up Expansion in Taiwan: up to 10 Fabs Reportedly under Construction or Starting in 2026
• Keysight to Demonstrate AI-Driven Wireless Innovations and 6G Readiness at Mobile World Congress 2026

Thursday, February 26, 2026

• Kaynes Semicon Pvt Ltd Adopts Advanced Simulation Solutions from Synopsys to Strengthen OSAT Capabilities
• ADTechnology Obtains ISO/IEC 27001:2022 Certification
• Keysight Technologies Reports First Quarter 2026 Results
• Embedded FPGA reaches a new stage of industrial maturity – Menta at Embedded World 2026
• Semidynamics Becomes 3-nm Ready, Moves Europe Toward Hardware Sovereignty
• SEALSQ Prioritizes Silicon-Based Quantum Computing to Align with Semiconductor Technology
• MIPI Alliance Releases UniPro v3.0 and M-PHY v6.0, Accelerating JEDEC UFS Performance for Edge AI in Mobile, PC and Automotive
• Accelerating semiconductor and electronic systems design using AI-powered digital twins
• Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
• ADTechnology and Fraunhofer IIS Join Forces for Advanced ASIC and Chiplet Development
• Moon Photonics: moving towards large-scale quantum photonics
• Europe’s stealth leading-edge process technology
• GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology

Wednesday, February 25, 2026

• China Reportedly Aims to Boost 7nm, 5nm Output Fivefold in Two Years, Driven by SMIC, Hua Hong
• UK-Based Arm to Train 15,000 Indonesian Engineers in Chip Design