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Wednesday, January 7, 2026
Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
Ceva Enhances NeuPro-Nano NPU Ecosystem with Addition of Sensory’s TrulyHandsfree Voice Activation
BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms
Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles
Tuesday, January 6, 2026
Creonic Releases Updated SDA OCT IP Core Supporting OCT 4.0 and Enhanced Synchronization
Monday, January 5, 2026
GUC Monthly Sales Report – Dec 2025
Nordic Semiconductor and OQ Technology demonstrate direct NTN LEO satellite connectivity
Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team
China’s SMIC moves to consolidate domestic chipmaking as it buys out SMNC minority stake.
SEMI forecasts semiconductor equipment sales reaching $156B by 2027
EU backs German chip fabs with €623m State aid
Canada Focuses Funding on Photonics and Quantum
Initiative CHASSIS for Chiplet Technology in the Automotive Sector
CES is now a major player in artificial intelligence — thanks to Nvidia CEO Jensen Huang
IoT in 2026: the technologies driving the next wave of IoT growth
Japan’s Rapidus set to rival TSMC and Samsung for chip supremacy
Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal
TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power
Chips&Media and Visionary.ai Unveil the World’s First AI-Based Full Image Signal Processor, Redefining the Future of Image Quality
Weebit Nano secures a license agreement with Texas Instruments
Monday, December 29, 2025
RISC-V IP: T2M Showcases RISC-V Production IP Core Portfolio for Next-Generation SoCs at CES’26
Friday, December 26, 2025
Challenges and Opportunities in the New Era of IoT Connectivity Opened by SGP.32 eSIM
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