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Tuesday, December 9, 2025
Silicon-Proven 16-bit 5MSps SAR ADC IP Cores Optimised for Automotive, Industrial, and IoT
Monday, December 8, 2025
DVB-S2 Demodulator Available For Integration From Global IP Core
Perceptia Announces Availability of Cryogenic 10-bit ADC and DAC IP in GF 22FDX
SoftBank's Arm plans to set up chip training facility in South Korea
Silicon’s Green Revolution: How Cutting-Edge Innovations are Forging a Sustainable Future for Semiconductors
Silicon Photonics Momentum Builds: Samsung Ramps R&D in Singapore, UMC Teams With IMEC
First-ever quantum chip combining electronics and photonics made in commercial CMOS foundry
Global cybersecurity agencies publish secure AI integration principles for OT
Nordic Semiconductor unveils nRF54LV10A - a breakthrough low-voltage Bluetooth LE SoC for next-gen healthcare wearables
Ceva-XC21 Named "Best IP/Processor of the Year" at EE Awards Asia
Innatera and 42T join forces to power the next wave of intelligent product innovation
Risc-v Cores and Neuromorphic Arrays Enable Scalable Digital Processors for EdgeAI Applications
CXL Adds Port Bundling to Quench AI Thirst
UMC and Polar Collaborate to Meet Growing Demand for U.S. Onshore Semiconductor Manufacturing
TSMC Strengthening Foundry 2.0 Leadership Amid Strong AI and Packaging Demand
Thursday, December 4, 2025
MosChip Collaborates with EMASS on Silicon Implementation for its Breakthrough Edge AI SoC
DCD-SEMI Unveils Ultra-Fast DAES IP Core for AES Encryption
Germany Redirects Intel Funds Into New Wave of Semiconductor Projects
Could an EU Chips Act 2.0 Bridge the Lab-to-Fab Gap?
BOS Semiconductors at 2025 Korea Tech Festival
Fraunhofer HHI advances indium phosphide photonics for high-speed data communication
Imec strengthens its global presence with new regional research & development hub in Qatar
VeriSilicon’s NPU IP VIP9000NanoOi-FS has achieved ISO 26262 ASIL B certification
The AI Future is Now All About the Edge
Certus Semiconductor adopts AI-powered Solido to accelerate IO library, analog IP and ESD development
Idaho Scientific Selects QuickLogic eFPGA Hard IP to Enable Crypto Agility
Open Chiplet Design Moves Forward with Tenstorrent’s OCA Plan
From Launch to Leadership: The Microservice Store Nominated for TechWorks Cybersecurity Award
Wednesday, December 3, 2025
Semidynamics Welcomes Iakovos Stamoulis as Chief Technology Officer
Attopsemi I-fuse® OTP was successfully adopted by Wiliot for IoT Pixels
Tuesday, December 2, 2025
Arteris Selected by Black Sesame Technologies for Next Generation of Intelligent Driving Silicon
NVIDIA and Synopsys Announce Strategic Partnership to Revolutionize Engineering and Design
Monday, December 1, 2025
SAICEC Partners with Siemens to Accelerate Chip-to-vehicle Validation
Friday, November 28, 2025
EU digital package promises €155B in savings with streamlined AI and data rules
Sovereign AI: The New Foundation of National Power
Intel Could Manufacture Apple M-Series Chips in 2027 with 18A-P Node
Thursday, November 27, 2025
BOS Semiconductors Eyes Expansion into ‘Intelligent Space’ AI Market Beyond ADAS
Edge AI’s Next Battlefield: Development Tools
Tenstorrent QuietBox tested: A high-performance RISC-V AI workstation trapped in a software blackhole
Finland: At the forefront of specialised microelectronics in Europe
Sustainability moves upstream delivering greener semiconductor design
Keysight Technologies Reports Fourth Quarter and Fiscal Year 2025 Results
Europe tackles e-waste with eco-friendly innovation that helps reuse and repair
Semiconductor supply risk management From firefighting to proactive strategy
BKT Waluj Plant Wins CII National Water Award for 25% Water Reduction
6 IoT semiconductor predictions for 2026
Codasip announces strategic licensing agreement with EnSilica for its CHERI-enabled embedded CPU from the 700 family
Synopsys Demonstrates Framework for Optimizing Manufacturing Processes with Digital Twins at Microsoft Ignite
InPsytech showcases 3nm UCIe 3.0 at OCP 2025, accelerating innovation in chiplet ecosystem
RPI and GlobalFoundries Partner on Semiconductor Research, Education, and Workforce Development Initiatives
TSMC to Build Three New 2 nm Fabs in Taiwan for $28 Billion
Intel confirms steady 18A yield improvements and 14A progress
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