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Wednesday, January 7, 2026

• Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
• Ceva Enhances NeuPro-Nano NPU Ecosystem with Addition of Sensory’s TrulyHandsfree Voice Activation
• BOS Semiconductors Selects Ceva’s AI DSP for Next-Generation ADAS Platforms
• Ceva Delivers Real-Time AI Acceleration on NXP’s Processors for Software-Defined Vehicles

Tuesday, January 6, 2026

• Creonic Releases Updated SDA OCT IP Core Supporting OCT 4.0 and Enhanced Synchronization

Monday, January 5, 2026

• GUC Monthly Sales Report – Dec 2025
• Nordic Semiconductor and OQ Technology demonstrate direct NTN LEO satellite connectivity
• Five-Year-Old Chinese EDA Firm Univista Sets Sights on IPO, Led by Ex-Synopsys and Cadence Team
• China’s SMIC moves to consolidate domestic chipmaking as it buys out SMNC minority stake.
• SEMI forecasts semiconductor equipment sales reaching $156B by 2027
• EU backs German chip fabs with €623m State aid
• Canada Focuses Funding on Photonics and Quantum
• Initiative CHASSIS for Chiplet Technology in the Automotive Sector
• CES is now a major player in artificial intelligence — thanks to Nvidia CEO Jensen Huang
• IoT in 2026: the technologies driving the next wave of IoT growth
• Japan’s Rapidus set to rival TSMC and Samsung for chip supremacy
• Samsung Emerges as Potential Second Foundry for NVIDIA Alongside TSMC After Groq Licensing Deal
• TSMC begins quietly volume production of 2nm-class chips — first GAA transistor for TSMC claims up to 15% improvement at ISO power
• Chips&Media and Visionary.ai Unveil the World’s First AI-Based Full Image Signal Processor, Redefining the Future of Image Quality
• Weebit Nano secures a license agreement with Texas Instruments

Monday, December 29, 2025

• RISC-V IP: T2M Showcases RISC-V Production IP Core Portfolio for Next-Generation SoCs at CES’26

Friday, December 26, 2025

• Challenges and Opportunities in the New Era of IoT Connectivity Opened by SGP.32 eSIM