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Thursday, October 30, 2025

• Synopsys Spotlights Agentic AI, Accelerated Computing, and AI Physics at NVIDIA GTC Washington, D.C.
• Faraday Reports Third Quarter 2025 Results
• Cadence Reports Third Quarter 2025 Financial Results
• Socionext Unveils "Flexlets™", a Configurable Chiplet Ecosystem to Accelerate Multi-die Silicon Innovation
• GlobalFoundries Plans Billion-Euro Investment to Expand Chip Manufacturing in Germany

Wednesday, October 29, 2025

• MosChip to Launch ProductXcelerate™ Blueprints at Embedded World North America
• Ceva and embedUR systems Partner to Launch ModelNova for NeuPro NPU Family, Expanding Edge AI Model Ecosystem

Monday, October 27, 2025

• Bosch, Volkswagen, Nokia and Europe’s Tech Giants Unite to Secure Photonics Future in FP10
• Cambridge GaN Devices partners with GlobalFoundries for advanced power devices
• FortifyIQ Secures the Quantum Era with Over-the-Air Updatable Cryptography
• Arm VP highlights Korea as rising hub for AI semiconductor innovation
• Europe Urged to Mobilize Private Capital for Quantum Competitiveness
• Intellectual Property Office survey: AI boom drives patent applications, placing Taiwan top 10
• The AI Chip Wars Intensify: Patent Battles Threaten to Reshape Semiconductor Innovation
• Nordic Semiconductor’s nRF Cloud powered by Memfault wins Cloud Computing Innovation of the Year Award at Mobile Breakthrough Awards
• Tesla splits AI5 chip production between Samsung and TSMC in strategic dual-foundry move
• Arm AI Chiplets Drive Open Standard for AI Infrastructure
• VSORA Launches Europe’s Most Powerful AI Inference Chip
• RISC-V Takes First Step Toward International Standardization as ISO/IEC JTC1 Grants PAS Submitter Status
• SmartDV Announces Multiple Customer Licenses for MIPI® SoundWire® I3S℠ 1.0 IP Portfolio
• UMC Introduces 55nm BCD Platform to Elevate Power Efficiency for Smartphones, Consumer Electronics, and Automotive Applications
• Intel's 18A Process Challenges TSMC, Samsung Foundry

Thursday, October 23, 2025

• RISC-V Exceeding Expectations in AI, China Deployment
• Arteris Selected by Axelera AI to Accelerate Computer Vision for Edge Devices
• Siemens updates Designcenter Solid Edge with AI and cloud-driven enhancements
• From Polish photonics to European EMS insights
• Axelera Announces Europa AIPU, Setting New Industry Benchmark for AI Accelerator Performance, Power Efficiency and Affordability
• Preliminary Characterisation Report for Perceptia’s pPLL08W in GF 22FDX Now Available
• Samsung Electronics Ranks 5th in Global Brands for the Sixth Consecutive Year
• Photonics21 and European industry campaign to secure photonics’ future
• Tata Technologies collaborates with Synopsys to accelerate Software‑Defined Vehicle innovation
• Soitec and CEA partner to develop automotive cybersecurity with advanced FD-SOI technology
• Keysight Enables SK hynix to Achieve Top-Tier OCP S.A.F.E. Evaluation for Solid-State Drive Solution
• SiPearl Unveils Athena1 Processor for Europe’s Dual-Use Needs
• Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing
• Tenstorrent Announces Open Chiplet Atlas™ Ecosystem to Accelerate and Standardize an Open Chiplet Ecosystem
• TSMC Reportedly Doubles Lithography Patents From 2016 to 2023, Extending Lead Over Rivals

Wednesday, October 22, 2025

• Semidynamics Inferencing Tools Accelerate AI App Deployment on Cervell NPU
• Arteris and Alibaba DAMO Academy Extend Partnership to Accelerate High-Performance RISC-V SoC Designs
• CAST Simplifies RISC-V Embedded Processor IP Adoption with New Catalyst Program
• Menta Brings its Pioneering eFPGA Technology to Embedded World North America 2025
• Weebit Nano delivers record quarterly customer receipts
• Ceva Introduces Wi-Fi 7 1x1 Client IP to Power Smarter, More Responsive AI-Enabled IoT Devices and Emerging Physical AI Systems

Tuesday, October 21, 2025

• Sofics Tapes Out Test Chip on TSMC 4nm Process with Novel ESD IP and Low-Power 1.8V and 3.3V GPIO Solutions
• Arteris Selected by 2V Systems for IO Chiplet for Data Center
• Ethernet IP Core Leaders – Comprehensive Portfolio from 10M to 10G
• Arm Accelerates the Edge AI Revolution with Easy, Low-Cost Access to Armv9 Platforms through Arm Flexible Access

Monday, October 20, 2025

• Nordic Semiconductor showcases comprehensive range of chip-to-cloud solutions at embedded world North America 2025
• TSMC Raises 2025 Revenue Forecast on AI Boom, U.S. Stock Rallies 1.6%
• Keysight Technologies Completes Acquisition of Spirent Communications PLC
• Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist
• The Green Revolution in Silicon: How the Semiconductor Industry is Forging a Sustainable Future
• Google's €5 Billion AI Bet in Belgium Ignites European Tech Landscape
• AI Chips Shifting from Round to Rectangular
• SEALSQ Announces Development of QASIC, the Quantum-Resistant ASIC, By IC’Alps
• Get Your Board On Board: Talking To Leadership About Post-Quantum Cryptography
• The Road to embedded world North America: PQShield Future-Proofs Embedded Security
• Upbeat Technology’s RISC-V MCU Takes Flight With Near-Threshold Computing
• Andes Showcases Expanding RISC-V Ecosystem and Next-Generation "Cuzco" High-Performance CPU at RISC-V Summit North America 2025
• Synopsys Unveils ‘Silicon Bring-Up’ of LPDDR6 IP On TSMC’s Cutting-Edge N2P Node, Reaching Bandwidth Up to a Whopping 86 GB/s
• Intel Foundry Reportedly Secures 18A Order from Microsoft for Maia 3 Accelerator
• NVIDIA partners with TSMC, and the first wafer of the Blackwell chips manufactured in the United States is unveiled.