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• GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology Validating 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and 112G-LR SerDes IPs (Monday, June 7, 2021)
• Edge AI Inferencing Opens Up New World of Opportunities (Thursday, May 27, 2021)
• Mirabilis Design and E-Elements Technology team up to provide concept-to-implementation design flow for AI applications (Wednesday, May 26, 2021)
• Lattice sensAI Solution Stack Simplifies Deployment of AI/ML Models on Smart Edge Devices (Tuesday, May 25, 2021)
• Siemens expands Simcenter with AI-driven generative engineering for systems architectures (Tuesday, May 25, 2021)
• proteanTecs' UCT to be Exhibited at the TSMC 2021 Online Technology Symposiums for North America, Europe and Taiwan (Tuesday, May 25, 2021)
• AI Driving Renewed Interest in Processing-in-Memory (Monday, May 24, 2021)
• BrainChip highlights its Akida Neural Processor at AI Field Day 2 (Monday, May 24, 2021)
• Chips&Media Making its Presence at the 2021 Embedded Vision Summit as an Exhibitor (Wednesday, May 19, 2021)
• Gyrfalcon Showcases AI-X at 2021 Embedded Vision Summit (Wednesday, May 19, 2021)
• 48-V Power Architecture for Next-Gen AI Processors (Monday, May 17, 2021)
• Dialog Semiconductor Adds AI, Data Analytics Partners to SmartServer Ecosystem (Tuesday, May 11, 2021)
• BrainChip Demonstrates Akida Neuromorphic Processor as Part of Data Science Week (Monday, May 10, 2021)
• Esperanto Technologies Adopts Movellus Maestro AI, Intelligent Clock Networks for Its ET-SoC-1 Chip (Monday, May 3, 2021)
• Pinnacle Imaging Systems Announces Denali 3.0 Soft ISP & HDR Sensor Module for New Xilinx Kria SOM Platform and Vision AI Starter Kit (Tuesday, April 20, 2021)
• Xilinx Introduces Kria Portfolio of Adaptive System-on-Modules for Accelerating Innovation and AI Applications at the Edge (Monday, April 19, 2021)
• Aspinity Expands into Audio Event Detection (Thursday, April 15, 2021)
• BrainChip Begins Volume Production of Akida AI Processor (Tuesday, April 13, 2021)
• OpenFive Tapes Out SoC for Advanced HPC/AI Solutions on TSMC 5nm Technology (Monday, April 12, 2021)
• Cloudera collaborates with NVIDIA to accelerate data analytics and AI in the cloud (Monday, April 12, 2021)
• Arm's solution to the future needs of AI, security and specialized computing is v9 (Tuesday, March 30, 2021)
• ReRAM Machine Learning Embraces Variability (Monday, March 29, 2021)
• GLOBALFOUNDRIES and Cadence Add Machine Learning Capabilities to DFM Signoff for GF's Most Advanced FinFET Solutions (Tuesday, March 23, 2021)
• CEVA Unveils MotionEngine Scout, a Highly-Accurate Dead Reckoning Software Solution for Indoor Autonomous Robots (Tuesday, March 23, 2021)
• https://www.eetimes.com/ai-drives-memory-interconnect-evolution (Wednesday, March 10, 2021)
• AI Drives Memory Interconnect Evolution (Wednesday, March 10, 2021)
• Eta Compute's Low Power AI Vision Board Accelerates Design, Test, and Deployment of Transformative Embedded Vision Solutions (Tuesday, March 9, 2021)
• Synopsys ARC EV Processor Enables Kyocera Document Solutions to Launch AI-enabled Multifunctional Printer SoC (Monday, March 8, 2021)
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Wednesday, March 3, 2021)
• BrainChip's Success in 2020 Advances Fields of On-Chip Learning and Ultra-Low Power Edge AI (Tuesday, March 2, 2021)
• Andes Technology and Rambus Collaborate to offer Secure Solution for MCU and IoT Applications (Tuesday, February 23, 2021)
• CMC Microsystems and Deeplite seek to advance AI R&D (Tuesday, February 23, 2021)
• Khronos and EMVA Collaborate to Gather Requirements for Embedded Camera and Sensor API Standards (Sunday, February 21, 2021)
• Syntiant Adopts Movellus' Clock Network for its Low-Power NDP120 Deep Learning Processor (Sunday, February 21, 2021)
• Enabling AI Vision at the Edge (Wednesday, February 17, 2021)
• Samsung Develops Industry's First High Bandwidth Memory with AI Processing Power (Tuesday, February 16, 2021)
• LeapMind Announces Participation in Alliance Program of Xilinx, a Major US FPGA Innovator (Monday, February 1, 2021)
• Imagination IP in Chinese AI integration (Sunday, January 31, 2021)
• Flex Logix Pairs its InferX X1 AI Inference Accelerator with the High-Bandwidth Winbond 4Gb LPDDR4X Chip to Set a New Benchmark in Edge AI Performance (Tuesday, January 26, 2021)
• Edge AI SoC for smart tiny devices (Tuesday, January 26, 2021)
• Patent report highlights AI boom (Tuesday, January 26, 2021)
• Edge AI company AlphaICs raises $8 million in funding round led by Emerald Technology Ventures and Endiya Partners (Monday, January 25, 2021)
• Nordic Development Kit provides easy access to AI and ML (Tuesday, January 19, 2021)
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing (Monday, January 18, 2021)
• CEA-Leti Reports Machine-Learning Breakthrough That Opens Way to Edge Learning (Monday, January 18, 2021)
• Syntiant Surpasses Milestone of 10 Million Processors Shipped (Tuesday, January 12, 2021)
• Synopsys and Socionext Expand Collaboration to Deploy HBM2E IP for 5-Nanometer Process in AI and High-Performance Computing SoCs (Monday, January 11, 2021)
• Arteris IP FlexNoc Interconnect and Resilience Package Licensed by Hailo for Artificial Intelligence (AI) Chip (Monday, January 11, 2021)
• CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family (Monday, January 11, 2021)
• Official Commercial Launch of Efficiera Ultra-Low Power AI Inference Accelerator IP Core (Sunday, January 10, 2021)