Search News

Artificial Intelligence News

• EU AI Will Rely on Emerging Memory Technologies (Thursday, July 4, 2019)
• Global AI Race Divided Over Data Privacy (Thursday, July 4, 2019)
• AGIC Tape Out First Silicon at 14nm FinFET Technology (Wednesday, July 3, 2019)
• Taiwan forms alliance to develop AI chips (Tuesday, July 2, 2019)
• Samsung Electronics Introduces A High-Speed, Low-Power NPU Solution for AI Deep Learning (Monday, July 1, 2019)
• Building an AI Platform for Medical Imaging System (Sunday, June 30, 2019)
• Aspinity Puts Neural Networks Back to Analog (Monday, June 24, 2019)
• Samsung Electronics to Strengthen its Neural Processing Capabilities for Future AI Applications (Monday, June 17, 2019)
• "Video For Machines" Using MPEG's New CDVA Standard, On Gyrfalcon's Industry Leading Chips (Monday, June 17, 2019)
• AI: Friend or Foe? (Tuesday, June 11, 2019)
• HBM2e Top Contender for AI Applications (Tuesday, June 4, 2019)
• SolidRun and Gyrfalcon Team Up to Accelerate On-Device AI Performance with Powerful New i.MX 8M Mini SOM (Sunday, June 2, 2019)
• Edge AI Going Beyond Voice and Vision (Tuesday, May 28, 2019)
• Synopsys ARC EV6x Vision Processor IP Named Best Processor of the Year by the Embedded Vision Alliance (Monday, May 20, 2019)
• Achronix Introduces Ground-Breaking FPGA Family, Delivering New Levels of Performance with Adaptability for High-Bandwidth Data Acceleration Applications (Monday, May 20, 2019)
• Arteris IP and Wave Computing Collaborate on Reference Architecture for Enterprise Dataflow Platform (Monday, May 20, 2019)
• New Cadence Tensilica Vision Q7 DSP IP Doubles Vision and AI Performance for Automotive, AR/VR, Mobile and Surveillance Markets (Tuesday, May 14, 2019)
• When AI Goes Wrong (Monday, May 13, 2019)
• eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip (Monday, May 6, 2019)
• Will Machines Ever Learn to Be Fair? (Thursday, May 2, 2019)
• Gyrfalcon Technology Introduces IP Licensing Model for Greater Customization for AI Chips from "Edge to Cloud" (Tuesday, April 23, 2019)
• Teledyne Imaging to showcase its advanced mapping, object recognition and tracking technology at AUVSI 2019 (Tuesday, April 23, 2019)
• Don't Worry, Be H(AI)ppy (Monday, April 15, 2019)
• Flex Logix Launches InferX X1 Edge Inference Co-Processor That Delivers Near-Data Center Throughput at a Fraction of the Power and Cost (Tuesday, April 9, 2019)
• Wave Computing Unveils New Licensable 64-Bit AI IP Platform to Enable High-Speed Inferencing and Training in Edge Applications (Tuesday, April 9, 2019)
• Using neural networks to predict failure on hard disk drives (Tuesday, April 2, 2019)
• AI: Market Trader and Market Cop (Monday, April 1, 2019)
• New high-speed GigE Vision cameras enable smooth transition from CCD to CMOS imaging (Monday, April 1, 2019)
• UltraSoC strengthens data science and machine learning team with appointment of new VP Software Development (Monday, March 25, 2019)
• Wave Collaborates with UC Berkeley's BAIR Open Research Alliance to Accelerate Cutting-Edge Artificial Intelligence Research (Monday, March 25, 2019)
• A Chinese Perspective: Is the U.S. Ahead in AI? (Sunday, March 24, 2019)
• New Merced EOS S3AI HDK from QuickLogic Enables Fast AI Endpoint Solution Development (Sunday, March 24, 2019)
• Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI (Monday, March 18, 2019)
• Is Analog Signal Processing the Future of AI? (Tuesday, March 12, 2019)
• CEVA Computer Vision, Deep Learning and Long Range Communication Technologies Power DJI Drones (Monday, March 11, 2019)
• Edge Intelligence the Focus at Embedded World (Wednesday, March 6, 2019)
• Graphcore Selected 16nm FinFet ESD Solutions from Sofics for its Transformative Artificial Intelligence Processor (Monday, February 25, 2019)
• Aerospace Companies Look to Utilize AI & Analytics (Wednesday, February 13, 2019)
• Trump Prioritises Artificial Intelligence (Tuesday, February 12, 2019)
• Eighth Annual "Leadership in Automation" Award Recognizes Teledyne DALSA as "First Team" Honoree (Monday, February 11, 2019)
• Governor Cuomo Announces IBM Investment To Create Artificial Intelligence Hardware Center At SUNY Poly Albany Campus (Wednesday, February 6, 2019)
• Is AI Robustness the Cost of Accuracy? (Wednesday, January 30, 2019)
• Key Metrics for Evaluating an Inferencing Engine (Tuesday, January 29, 2019)
• Arteris IP Adds 20 New Licensees and Releases Three New Products in 2018 (Monday, January 28, 2019)
• New DRAM Architecture Targets Edge AI (Wednesday, January 16, 2019)
• Mentor's Catapult HLS enables Chips&Media to deliver deep learning hardware accelerator IP in half the time (Tuesday, January 15, 2019)
• Launch of first European Artificial Intelligence platform coordinated by Thales (Wednesday, January 9, 2019)
• Baidu unveils open source edge computing platform and AI boards (Tuesday, January 8, 2019)
• STMicro adds AI features to the STM32 toolbox (Tuesday, January 8, 2019)
• VeriSilicon and NXP Collaborate on Machine Learning Across Wide Range of ML-Enabled Devices (Monday, January 7, 2019)