Search News

Artificial Intelligence News

• DMP Released Next-Generation AI Accelerator IP "ZIA A3000 V2" - Industry-leading PPA efficiency to propel the future of edge AI (Sunday, November 10, 2024)
• Bill Gropp on 'Different Approaches to AI' (Tuesday, November 5, 2024)
• Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions (Monday, November 4, 2024)
• PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC (Wednesday, October 30, 2024)
• Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency (Wednesday, October 30, 2024)
• Siemens strengthens leadership in industrial software and AI with acquisition of Altair Engineering (Tuesday, October 29, 2024)
• DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU) (Tuesday, October 29, 2024)
• BrainChip Accerates AI at the Edge With New Low-Power Neural Processor (Tuesday, October 29, 2024)
• Xylon Announces New logicBRICKS Vision AI Framework for AMD Adaptive SoCs (Monday, October 28, 2024)
• From AI to Sustainability: Arm Has a Comprehensive Approach to Innovation (Sunday, October 27, 2024)
• Next generation AI chip design exploration at imec UK (Thursday, October 24, 2024)
• Empowering a sustainable AI revolution (Thursday, October 24, 2024)
• MosChip Technologies joins Renesas RZ Partner Ecosystem as AI/ML Design Partner (Monday, October 21, 2024)
• Arteris Evolves Its Network-on-Chip Tiling to Accelerate AI Designs (Friday, October 18, 2024)
• Samsung offers first 24Gb GDDR7 DRAM for AI computing (Wednesday, October 16, 2024)
• Rebellions partners with Arm on AI computing chiplet Techs (Tuesday, October 15, 2024)
• Efabless Goes the Custom Route for Edge ML (Tuesday, October 15, 2024)
• eMemory Join Forces with Siemens on Groundbreaking SRAM Repair Toolset: Pre-integrated Tessent MemoryBIST with NeoFuse OTP (Monday, October 14, 2024)
• Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications (Monday, October 14, 2024)
• Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter (Monday, October 14, 2024)
• AI and Semiconductors: A Symbiotic Relationship (Monday, October 14, 2024)
• SEMIFIVE Extends Partnership with Arm to Advance AI and HPC SoC Platforms (Sunday, October 13, 2024)
• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel (Sunday, October 13, 2024)
• Efabless Unveils New Custom Chip Platform Designed for Edge ML Products (Tuesday, October 8, 2024)
• Uncovering Silent Data Errors with AI (Thursday, October 3, 2024)
• RaiderChip brings Meta Llama 3.2 LLM HW acceleration to low cost FPGAs (Monday, September 30, 2024)
• BrainChip Introduces Lowest-Power AI Acceleration Co-Processor (Monday, September 30, 2024)
• Paul Williamson on Edge AI, Llama 3.2 on Arm (Sunday, September 29, 2024)
• Paul Williamson on Edge AI, Llama 3.2 on Arm (Friday, September 27, 2024)
• Dnotitia Announces Strategic Partnership with Korea University Anam Hospital and Advanced Medical Imaging Research Institute to Develop LLM-based Medical AI Solutions (Thursday, September 26, 2024)
• Preferred Networks Inc. adopts Siemens' PowerPro software for next-generation AI chip design (Tuesday, September 24, 2024)
• Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America (Tuesday, September 24, 2024)
• GenAI v1-Q launched with 4 bits Quantization support to accelerate larger LLMs at the Edge (Monday, September 23, 2024)
• Dnotitia Announces Strategic MOU with VESSL AI to Pioneer Next-Generation AI Innovation (Monday, September 23, 2024)
• Ceva and Edge Impulse Join Forces to Enable Faster, Easier Development of Edge AI Applications (Monday, September 23, 2024)
• Advanced Packaging Drives New Memory Solutions for the AI Era (Wednesday, September 18, 2024)
• Alphawave Semi to Showcase Latest Advances in AI Connectivity IP at ECOC 2024 (Tuesday, September 17, 2024)
• Ultralight Edge AI Platform Unveiled (Monday, September 16, 2024)
• Chinese researchers develop ultra-efficient AI processor (Monday, September 16, 2024)
• China wants to challenge the U.S. in AI – here's what Chinese giants are doing with the tech (Tuesday, September 10, 2024)
• Sondrel announces Advanced Modelling Process for AI chip designs (Monday, September 9, 2024)
• Rambus Announces Industry-First HBM4 Controller IP to Accelerate Next-Generation AI Workloads (Monday, September 9, 2024)
• Inspired by neurons: Neuromorphic hardware and the future of chip design (Sunday, September 8, 2024)
• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions (Sunday, September 8, 2024)
• Alphawave Semi "Redefines Connectivity" in AI Hardware and Edge AI Summit 2024 Presentation on Chiplet Interconnects (Sunday, September 8, 2024)
• U.S. seeking export controls on quantum computing; limited impact expected for S. Korean firms (Thursday, September 5, 2024)
• Quebec's AI hub drives semiconductor research and development (Wednesday, September 4, 2024)
• DeepX Hints At Next-Gen AI Chips (Sunday, September 1, 2024)
• F5 and Intel collaboration simplifies the security and delivery of AI services (Wednesday, August 28, 2024)
• Strategies to Dominate the AI Accelerator Market (Tuesday, August 27, 2024)