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Artificial Intelligence News

• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design (Monday, September 18, 2023)
• Intel Innovation 2023: Empowering Developers to Bring AI Everywhere (Monday, September 18, 2023)
• HighTec, Synopsys team for AI on Infineon's AURIX TC4x (Sunday, September 17, 2023)
• Efabless Design Challenge Winners Advance the Power of AI in Chip Design (Tuesday, September 12, 2023)
• Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design (Tuesday, September 12, 2023)
• Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras (Monday, September 11, 2023)
• Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud (Monday, September 11, 2023)
• From Synopsys to Google, New EDA Tools Apply Advanced AI to IC Design (Monday, September 11, 2023)
• BrainChip Showcases Foundation for next generation AI solutions at AI Hardware & Edge AI Summit (Wednesday, September 6, 2023)
• Synopsys Extends Synopsys.ai EDA Suite with Industry's First Full-Stack Big Data Analytics Solution (Wednesday, September 6, 2023)
• Credo Introduces Industry's First Monolithically Integrated CMOS VCSEL Driver in an 800G DSP (Tuesday, September 5, 2023)
• OPENEDGES Highlights Advanced Memory Subsystem IPs at the AI Hardware & Edge AI Summit 2023 (Sunday, September 3, 2023)
• BrainChip and Tata Elxsi Partner to Provide Intelligent, Ultralow-Power Solutions (Monday, August 28, 2023)
• BrainChip Continues to Expand IP Portfolio with Latest Australian Patent Issuance (Thursday, August 24, 2023)
• Synopsys to add generative AI to design tools (Wednesday, August 23, 2023)
• Nordic to acquire AI/ML technology in the US (Wednesday, August 23, 2023)
• Groq Selects Samsung Foundry to Bring Next-gen LPU™ to the AI Acceleration Market (Wednesday, August 23, 2023)
• Esperanto Pivots to HPC and Generative AI (Tuesday, August 22, 2023)
• China-owned Dream Chip tapes out 10TOPS SoC (Monday, August 21, 2023)
• Synopsys to add generative AI to design tools (Sunday, August 20, 2023)
• Samsung semiconductor facility in Texas will produce 4nm AI processors for Groq (Sunday, August 20, 2023)
• Dream Chip Technologies tapes out a 10-TOPS SoC in 22nm with a novel AI Accelerator and an Automotive Functional Safety Processor (Thursday, August 17, 2023)
• Rapid Silicon Announces RapidGPT's Official Availability (Tuesday, August 15, 2023)
• Tachyum Achieves 192-Core Chip After Switch to New EDA Tools (Tuesday, August 15, 2023)
• Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale (Tuesday, August 15, 2023)
• Nvidia, Cadence, and Ceva Keep Up With AI Processing Demands (Tuesday, August 15, 2023)
• Collaboration looks to build AI Accelerator chip with analogue in-memory computing (Monday, August 14, 2023)
• 21 generative AI startups to watch, according to investors (Monday, August 14, 2023)
• Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing (Thursday, August 10, 2023)
• BrainChip and Edge Impulse Offer a Neuromorphic Deep Dive into Next-Gen Edge AI Solutions (Wednesday, August 9, 2023)
• Understanding the Compute Hardware Behind Generative AI (Wednesday, August 9, 2023)
• Blueshift Memory announces successful development of computer vision AI accelerator chip (Tuesday, August 8, 2023)
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family (Sunday, August 6, 2023)
• CEVA Doubles Down on Generative AI with Enhanced NeuPro-M NPU IP Family (Sunday, August 6, 2023)
• Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform (Wednesday, August 2, 2023)
• University of Virginia Joins the BrainChip University AI Accelerator Program (Tuesday, August 1, 2023)
• LeapMind's Ultra Low-Power AI accelerator IP "Efficiera" Achieved industry-leading power efficiency of 107.8 TOPS/W (Monday, July 31, 2023)
• PCIe Eyes Road Ahead with AI, Automotive (Sunday, July 30, 2023)
• Siemens launches assistive AI solution for IC design and verification (Sunday, July 23, 2023)
• Promising Returns For Synopsys.ai Suite Of AI Solutions (Sunday, July 23, 2023)
• BrainChip's Latest US Patent Award Extends Intellectual Property Strength and its Leadership in Edge Learning (Wednesday, July 19, 2023)
• Expedera Announces LittleNPU AI Processors for Always-Sensing Camera Applications (Tuesday, July 18, 2023)
• VSORA reveals Jotunn generative AI processor (Tuesday, July 18, 2023)
• OmniSpeech, Cadence Tensilica team up on voice AI technology (Monday, July 17, 2023)
• proteanTecs and Teradyne Partner to Bring Machine Learning-driven Telemetry to SoC Testing (Monday, July 10, 2023)
• Second contest for Generative AI chip design (Monday, July 10, 2023)
• Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment (Sunday, July 9, 2023)
• Siemens advances intelligent custom IC verification platform with new, AI-powered Solido Design Environment (Sunday, July 9, 2023)
• AI Can't Design Chips Without People (Monday, July 3, 2023)
• Canada's semiconductor industry seeks renaissance from AI, shifting geopolitics (Sunday, July 2, 2023)