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• Comcores and DENSO AUTOMOTIVE Deutschland GmbH test TSN Ethernet for Automotive Applications in the Research Project EMPHASE (Tuesday, April 30, 2019)
• Cadence LPDDR4/4X Memory IP Subsystem Achieves ISO 26262 ASIL C Certification from SGS-TUV Saar Using TSMC 16FFC Process Technology (Tuesday, April 16, 2019)
• Autonomous challenges (Wednesday, April 3, 2019)
• Arteris IP FlexNoC Interconnect Licensed by Horizon Robotics for ADAS Chips (Monday, April 1, 2019)
• Top court's new IP tribunal upholds French firm's patent (Wednesday, March 27, 2019)
• Arteris IP FlexNoC Interconnect Licensed by Morningcore for Automotive LTE-V2X Modems for China Market (Monday, March 25, 2019)
• Standardizing the ADAS Lexicon (Monday, March 18, 2019)
• Automotive Industry Steers European Patent Growth (Monday, March 18, 2019)
• ON Semiconductor Collaborates with NVIDIA on Cloud-Based Autonomous Vehicle Simulation (Monday, March 18, 2019)
• Cobham Gaisler's HiRel GR712RC processor was launched on February 21, 2019 onboard the SpaceIL mission to the Moon (Tuesday, March 5, 2019)
• Thales and Telstra Join Forces to Unlock the Potential of Low-altitude Airspace (Thursday, February 28, 2019)
• New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications (Monday, February 25, 2019)
• Cadence and Green Hills Software Announce Strategic Partnership to Accelerate Embedded System Safety and Security (Monday, February 18, 2019)
• The Future of the Cars and ADAS (Wednesday, February 13, 2019)
• Sital Technology Announces the World's First Secured 1553 Component (Tuesday, February 5, 2019)
• Synopsys and SAE International Release New Study Highlighting Critical Cybersecurity Risks in the Automotive Industry (Tuesday, February 5, 2019)
• STMicroelectronics and Hyundai Autron Launch Development Lab for Eco-Friendly Automotive Solutions (Sunday, February 3, 2019)
• Toshiba Announces Latest Ethernet Bridge IC for Automotive and Industrial Applications (Monday, January 21, 2019)
• Smart Battery for EV Even When Cell Fails (Sunday, January 20, 2019)
• The Dilemma of Robocar Testing... (Thursday, January 17, 2019)
• EU Approves $2 Billion for IoT, Connected Car Research (Tuesday, January 15, 2019)
• Qualcomm Expands Chip Lineup Targeting Car Dashboards (Thursday, January 10, 2019)
• USB Type-C Controller Targets Fast Charging of Portables in Vehicles (Wednesday, January 9, 2019)
• Samsung's Exynos Auto V9 to Power Next-generation Platform for Audi's In-vehicle Infotainment System (Wednesday, January 2, 2019)
• Robocar Tech Faces 'Major Pain' in 2019 (Tuesday, January 1, 2019)
• SST Announces Automotive Grade 1 Qualification of Embedded SuperFlash Memory on UMC's 55 nm Platform (Tuesday, January 1, 2019)
• How to Power the Automotive TFT-LCD Displays of the (Not-so-Distant) Future (Thursday, December 20, 2018)
• Ambarella Joins 'Open Vision' ADAS Club (Wednesday, December 19, 2018)
• Attopsemi Technology Attended SemIsrael 2018 and Presented a Talk (Wednesday, December 19, 2018)
• Arm announces new "Automotive Enhanced" processor designed for safe next-gen driver experiences (Monday, December 17, 2018)
• Imagination reveals next step in PowerVR automotive strategy (Monday, November 12, 2018)
• UltraSoC and ResilTech partner to further functional safety in automotive systems (Wednesday, October 24, 2018)
• A View from Above - Aldec Adds 'Bird's Eye View' Function to Growing Portfolio of ADAS FPGA-based Reference Designs for TySOM™-3-ZU7EV Embedded Development Kit (Monday, October 15, 2018)
• GLOBALFOUNDRIES Delivering 8SW RF SOI Client Chips on 300mm Platform for Next-Generation Mobile Applications (Wednesday, September 26, 2018)
• M31 MIPI M-PHY is certified with ASIL-B safety level of ISO 26262 to provide safe and reliable automotive SoC design (Wednesday, September 26, 2018)
• Latest Releases of the LucidShape Product Family Support Faster, More Efficient Automotive Lighting Simulations (Tuesday, September 25, 2018)
• Adesto Touts ReRAM for Automotive (Tuesday, September 11, 2018)
• Cracking The Auto IC Market (Wednesday, September 5, 2018)
• RoodMicrotec selected as key partner for EnSilica automotive ASIC project (Monday, August 27, 2018)
• An inside look: Innovation, automotive test, and what's next (Wednesday, August 22, 2018)
• HfS Positions L&T Technology Services in 'Winner's Circle' for Automotive Engineering Services (Sunday, August 19, 2018)
• Fundamentals of Semiconductor ISO 26262 Certification: People, Process and Product (Tuesday, August 14, 2018)
• Autonomous Vehicles Driving New Data Interfaces (Thursday, August 9, 2018)
• Leti: Pilot Program to Characterize Lidar Sensors (Tuesday, July 17, 2018)
• Xylon: Available MPSoC Version of the logiADAK ADAS Development Kit (Thursday, July 12, 2018)
• Automotive, technology players join forces on in-car Multi-Gig-networking (Wednesday, June 27, 2018)
• Arbe Robotics Selects Synopsys' IP to Enable its High-Resolution Imaging Radar to Achieve the Highest Automotive Safety Level for Autonomous Vehicles (Monday, June 25, 2018)
• Silexica raises $18m in Series B funding to advance software development solutions for autonomous driving (Wednesday, June 20, 2018)
• M31 Receives ISO 26262 Development Process Certification and Enters Advanced Automotive Electronics Market (Tuesday, June 19, 2018)
• NXP Processors Deliver Performance and Safety for Next-Generation Electric and Autonomous Vehicles (Sunday, June 17, 2018)