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Automotive News

• Imagination and CoreAVI partner for safety-critical automotive graphics applications (Monday, March 13, 2023)
• CEVA Introduces UWB Radar Platform for Automotive Child Presence Detection to Meet Emerging Safety Specifications (Wednesday, March 8, 2023)
• Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production (Monday, March 6, 2023)
• JEDEC Creates New Automotive Steering Subcommittee (Sunday, March 5, 2023)
• Safety element for automobiles, production or health can be implemented on the own microcontroller chip: RISC-V processor AIRISC-SAFETY from Fraunhofer Institute for Microelectronic Circuits and Systems IMS (Wednesday, March 1, 2023)
• Renesas develops technologies for automotive gateway SoCs (Tuesday, February 21, 2023)
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Monday, February 20, 2023)
• Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Monday, February 20, 2023)
• ESA and UK Space Agency back EnSilica to develop satellite broadband chip (Sunday, February 19, 2023)
• 12bit 5Gsps Current Steering DAC IP Core for Highspeed Communication and Automotive SoCs is available for immediate licensing (Sunday, February 19, 2023)
• Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification (Sunday, February 19, 2023)
• HARMAN and proteanTecs Collaborate to Advance Predictive and Preventive Maintenance for Automotive Electronics (Tuesday, February 7, 2023)
• The latest ASIL-B,C,D, ISO26262 Certified Silicon Proven Interface IP Cores are ready for immediate licensing (Sunday, January 22, 2023)
• Electric vehicles: CEA and Renault Group develop a very high efficiency bidirectional on-board charger (Wednesday, January 18, 2023)
• Vsora Unveils AI Chip Family to Enable L2-L5 Autonomous Driving (Tuesday, January 17, 2023)
• GA-ASI selects Siemens Xcelerator for digital transformation (Monday, January 16, 2023)
• Cadence Now Supports Dolby Atmos for Cars (Thursday, January 12, 2023)
• PDF Solutions and proteanTecs Announce Collaboration to Deliver Combined Solutions for Semiconductor Analytics to Address the Needs of Data Centers and Automotive Makers (Tuesday, January 10, 2023)
• ADAS Back in the Driver's Seat at CES 2023 (Tuesday, January 10, 2023)
• Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars (Thursday, January 5, 2023)
• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023 (Tuesday, January 3, 2023)
• intoPIX shows the new lightweight video compression standards and technologies driving automotive at CES 2023 (Tuesday, January 3, 2023)
• Latest aiWare4+ automotive NPU brings enhanced programmability, flexibility and scalability while retaining highest efficiency (Tuesday, December 13, 2022)
• MIPS Partners With Mobileye to Accelerate Next Generation Autonomous Driving Technologies and Advanced Driver Assistance Systems (Sunday, December 11, 2022)
• Andes Technology and Parasoft Collaborate to Provide Seamless Software Testing Tools for Automotive Functional Safety Applications (Tuesday, December 6, 2022)
• Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications (Monday, December 5, 2022)
• Mixel Patented MIPI D-PHY RX+ IP Integrated into Lumissil Automotive Microcontroller (Monday, December 5, 2022)
• Safety-Aware Chips Serve Automonous-Driving Apps (Sunday, December 4, 2022)
• ItoM is now part of the Bosch Group (Wednesday, November 30, 2022)
• CAN 2.0 and LIN 2.2 Controller IP Cores with ASIL B, C and D packages for High-End Automotive and Consumer Applications (Sunday, November 27, 2022)
• Sweden opens advanced automotive cyber security centre (Sunday, November 27, 2022)
• Defacto's SoC Compiler Certified ISO26262 (Wednesday, November 23, 2022)
• CAES Supports NASA's Return to the Moon (Sunday, November 20, 2022)
• Stellantis Accelerates Autonomous Driving Journey with Acquisition of aiMotive, a Leading Artificial Intelligence and Autonomous Driving Start-up (Wednesday, November 16, 2022)
• eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications (Tuesday, November 15, 2022)
• DSP Concepts and Analog Devices Collaborate on Solution for Rapid Design of In-Vehicle Audio Entertainment Systems (Tuesday, November 15, 2022)
• MEMS micro-mirrors improve Lidar sensing for vehicles (Wednesday, November 9, 2022)
• What's Driving the Latest Automotive Designs (Tuesday, November 8, 2022)
• Market Dynamics, Technologies Drive Automotive Design (Sunday, November 6, 2022)
• SiMa.ai Welcomes Industry Leader Harald Kroeger to Scale its Business in the Automotive Market (Wednesday, November 2, 2022)
• Cadence Accelerates RF Design with Delivery of New TSMC N16 mmWave Reference Flow (Wednesday, October 26, 2022)
• More than 50 members join SOAFEE to enable the software-defined vehicle of the future (Tuesday, October 25, 2022)
• Socionext to present its Automotive Expertise at electronica 2022 (Sunday, October 23, 2022)
• videantis and ADTechnology to build 5nm ADAS/AD SoCs (Tuesday, October 18, 2022)
• Introducing T2M's impressive collection of Silicon Proven, Automotive Grade Interface IP Cores (Sunday, October 16, 2022)
• Capgemini fuels collaboration with Panasonic Automotive Systems Company of America through transformative new data platform (Monday, October 3, 2022)
• Soitec Sees Big Opportunity in EVs with SmartSiC Wafers (Thursday, September 29, 2022)
• Automotive IC Marketshare Seen Rising to 10% by 2026 (Tuesday, September 27, 2022)
• Chips&Media Expands to New Markets such as Autonomous Vehicles (Monday, September 26, 2022)
• Renesas Launches Integrated Development Environment That Enables ECU-Level Automotive Software Development Without Hardware (Monday, September 26, 2022)