Search News

Automotive News

• iWave unveils the implementation of ARINC 818-2 IP Core in next-generation Combat Aircraft, designed by the Aeronautical Development Agency (ADA), Bangalore, India (Wednesday, July 20, 2022)
• Arm, Cruise and the driverless road ahead (Wednesday, July 20, 2022)
• Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development (Wednesday, July 13, 2022)
• WiLAN Signs Second Wireless License in Automotive Industry (Tuesday, July 5, 2022)
• Automotive Cybersecurity: More Than In-Vehicle and Cloud (Monday, July 4, 2022)
• Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets (Sunday, July 3, 2022)
• New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs (Wednesday, June 29, 2022)
• EnSilica chassis control ASIC for premium automotive brand enters mass production (Tuesday, June 28, 2022)
• Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics (Monday, June 27, 2022)
• CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles (Tuesday, June 21, 2022)
• Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC (Sunday, June 19, 2022)
• Imagination GPU approved by HORIBA MIRA Certification Limited for functionally safe ADAS and HMI applications (Monday, June 13, 2022)
• Toshiba and Japan Semiconductor Develop Highly Reliable Versatile Analog Platform with Floadia's G1 technology for Automotive Applications (Wednesday, June 8, 2022)
• The Automotive Industry is driving down acceptable chip defect levels (Tuesday, June 7, 2022)
• aiMotive ships first aiWare4 NPU production RTL (Wednesday, June 1, 2022)
• Arasan announces its 2'nd Generation of CAN IP (Thursday, May 19, 2022)
• VeriSilicon's Chip Design Process Obtains ISO 26262 Automotive Functional Safety Management System Certification (Thursday, May 19, 2022)
• Creonic GmbH joins NewSpace Initiative (Monday, May 9, 2022)
• Renesas equips vehicle computer with optical broadband interface (Monday, May 2, 2022)
• Sondrel Deploys Arteris IP for Next-Generation Multi-Channel Automotive SoC (Monday, May 2, 2022)
• The software-defined vehicle needs hardware that goes the distance (Thursday, April 28, 2022)
• Renesas Debuts Automotive ECU Virtualization Solution Platform to Enable Secure Integration of Multiple Applications for Zone ECU (Monday, April 25, 2022)
• Imagination and Ambarella partner on autonomous vehicle human-machine interface visualisations with ASIL functional safety (Sunday, April 24, 2022)
• Agnisys Announces ISO 26262 and IEC 61508 Qualification for Entire IDesignSpec Suite - SoC Specification Automation Flow (Monday, April 18, 2022)
• Automotive Functional Safety with DCD's CAN ALL IP Core (Wednesday, April 13, 2022)
• Virtual development environment for fast automotive application software development (Tuesday, April 12, 2022)
• What Drives Autonomous Vehicles? (Tuesday, April 5, 2022)
• Silicon Creations' Engineering Team Completes Training for Automotive Quality Certification (Tuesday, April 5, 2022)
• Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group (Monday, April 4, 2022)
• Microcontrollers Get a Lift from Automotive After 2021 Rebound (Tuesday, March 29, 2022)
• Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market (Monday, March 21, 2022)
• CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs (Sunday, March 20, 2022)
• Rambus Accelerates Automotive SoC Design with ASIL-B Certified Embedded Hardware Security Module (Wednesday, March 9, 2022)
• The Future of Automotive Connectivity (Tuesday, March 8, 2022)
• Raising the Bar on Autonomous Vehicle Safety (Wednesday, February 23, 2022)
• Audi is bringing 5G connectivity to its vehicles in 2024 (Monday, February 21, 2022)
• Arm Advances Adoption of ADAS, Automation Technologies (Sunday, February 20, 2022)
• Arm introduces new automotive image signal processor to advance adoption of driver assistance and automation technologies (Thursday, February 17, 2022)
• DCD-SEMI introduces secure & comprehensive CAN-ALL solutions for automotive (Wednesday, February 16, 2022)
• EU allocates 6bn euros to satellite communication plan (Tuesday, February 15, 2022)
• NSCore, Inc. Introduces its Automotive Grade-1 Qualified Non-Volatile Memory solution to help address the increasing need for Low Cost Semiconductor Chips (Tuesday, February 1, 2022)
• CAES Collaborates with Lattice Semiconductor to Provide Radiation-Tolerant FPGAs for Distributed Satellite Computing Applications (Sunday, January 30, 2022)
• The Real Reason Behind the Automotive Industry IC Shortage - A Step-Function Surge in Demand! (Wednesday, January 26, 2022)
• Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications (Sunday, January 23, 2022)
• Siemens collaborates with UMC on design kits for automotive and power applications (Wednesday, January 19, 2022)
• Mercedes Applies Neuromorphic Computing in EV Concept Car (Monday, January 17, 2022)
• MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface (Monday, January 17, 2022)
• Faraday IP Solutions Certified by SGS-TUV for ISO 26262 ASIL-D Ready (Monday, January 17, 2022)
• Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems (Sunday, January 16, 2022)
• VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving (Tuesday, January 11, 2022)