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Automotive News

• Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group (Monday, April 4, 2022)
• Microcontrollers Get a Lift from Automotive After 2021 Rebound (Tuesday, March 29, 2022)
• Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market (Monday, March 21, 2022)
• CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs (Sunday, March 20, 2022)
• Rambus Accelerates Automotive SoC Design with ASIL-B Certified Embedded Hardware Security Module (Wednesday, March 9, 2022)
• The Future of Automotive Connectivity (Tuesday, March 8, 2022)
• Raising the Bar on Autonomous Vehicle Safety (Wednesday, February 23, 2022)
• Audi is bringing 5G connectivity to its vehicles in 2024 (Monday, February 21, 2022)
• Arm Advances Adoption of ADAS, Automation Technologies (Sunday, February 20, 2022)
• Arm introduces new automotive image signal processor to advance adoption of driver assistance and automation technologies (Thursday, February 17, 2022)
• DCD-SEMI introduces secure & comprehensive CAN-ALL solutions for automotive (Wednesday, February 16, 2022)
• EU allocates 6bn euros to satellite communication plan (Tuesday, February 15, 2022)
• NSCore, Inc. Introduces its Automotive Grade-1 Qualified Non-Volatile Memory solution to help address the increasing need for Low Cost Semiconductor Chips (Tuesday, February 1, 2022)
• CAES Collaborates with Lattice Semiconductor to Provide Radiation-Tolerant FPGAs for Distributed Satellite Computing Applications (Sunday, January 30, 2022)
• The Real Reason Behind the Automotive Industry IC Shortage - A Step-Function Surge in Demand! (Wednesday, January 26, 2022)
• Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications (Sunday, January 23, 2022)
• Siemens collaborates with UMC on design kits for automotive and power applications (Wednesday, January 19, 2022)
• Faraday IP Solutions Certified by SGS-TUV for ISO 26262 ASIL-D Ready (Monday, January 17, 2022)
• MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface (Monday, January 17, 2022)
• Mercedes Applies Neuromorphic Computing in EV Concept Car (Monday, January 17, 2022)
• Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems (Sunday, January 16, 2022)
• Industry's First use of TLM for the At-Speed Verification of a PCIe-Based Avionics Design Requiring DO-254 Compliance (Tuesday, January 11, 2022)
• VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving (Tuesday, January 11, 2022)
• Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests (Thursday, December 16, 2021)
• BMW Group Signs Agreement with Inova Semiconductor and GlobalFoundries to Secure Supply (Wednesday, December 8, 2021)
• BMW, GloFo sign chip supply agreement (Tuesday, December 7, 2021)
• Ford, GlobalFoundries Aim to Boost Domestic IC Supplies (Thursday, December 2, 2021)
• videantis achieves Automotive SPICE Level 2 certification (Tuesday, November 30, 2021)
• Soitec and Mersen announce strategic partnership to develop new silicon carbide (SiC) substrates for the electric vehicle market (Monday, November 29, 2021)
• VeriSilicon Image Signal Processor IP Achieved ISO 26262 Automotive Functional Safety Certification (Tuesday, November 23, 2021)
• CEVA SensPro Sensor Hub DSP Achieves Automotive Safety Compliant Certification for ASIL B (Random) and ASIL D (Systematic) (Monday, November 22, 2021)
• 5 Trends Shaping the Automotive Perception Market (Saturday, November 20, 2021)
• Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family (Thursday, November 18, 2021)
• DCD-SEMI joins CAN in Automation, a leading CAN manufacturers' group (Wednesday, November 17, 2021)
• GlobalFoundries, Ford to Address Auto Chip Supply and Meet Growing Demand (Wednesday, November 17, 2021)
• IAR Systems enables next generation automotive applications with NXP's S32K3 MCU family (Sunday, November 14, 2021)
• Is the Spec for Vehicle Automation Levels a Dead End? (Sunday, November 14, 2021)
• Is Digital Radar the Answer to ADAS Interference? (Tuesday, November 9, 2021)
• Imagination and Mobica partner to create virtualized automotive environment (Monday, November 8, 2021)
• Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor (Tuesday, November 2, 2021)
• Four automotive functional safety mistakes that must be avoided (Tuesday, November 2, 2021)
• Omni Design Announces Availability of LiDAR Receiver Subsystem (Tuesday, October 26, 2021)
• 5GCroCo Project Advances Cross-border Connectivity for Cars (Tuesday, October 26, 2021)
• Cadence Introduces Comprehensive Safety Solution for Faster Certification of Automotive and Industrial Designs (Monday, October 18, 2021)
• Synopsys, Dassault Systèmes team for lighting digital twin (Monday, October 18, 2021)
• MIPI Alliance Completes Development of A-PHY v1.1, Doubling Maximum Data Rate and Adding New Options to Automotive SerDes Interface (Sunday, October 10, 2021)
• Four automotive functional safety mistakes that must be avoided (Wednesday, September 22, 2021)
• Update to Royalty-Free MIPI I3C Basic Utility and Control Bus Specification Boosts Speed and Flexibility (Monday, September 20, 2021)
• Renesas looks to accelerate deep learning development for ADAS applications (Monday, September 20, 2021)
• US chipmaker GlobalFoundries to double auto chip output for 2021 (Wednesday, September 15, 2021)