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• GF and Synopsys Deliver New Reference Flows for GF 22FDX Process: Cloud-Qualified and First Automotive Flow for ASIL-D Designs (Tuesday, September 14, 2021)
• New Arm Technologies to Transform the Software-defined Future for the Automotive Industry (Tuesday, September 14, 2021)
• Renesas and OmniVision Deliver Integrated Reference Design For Automotive Camera Systems (Monday, September 13, 2021)
• Aviva Technology Holding Raises $26.5M Series A Financing to Accelerate Automotive Connectivity (Wednesday, September 8, 2021)
• Efinix Announces AEC-Q100 Qualification and Automotive Product Line Initiative (Wednesday, September 8, 2021)
• Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles (Monday, September 6, 2021)
• Auto LiDAR set for 111% CAGR 2020-26 (Sunday, September 5, 2021)
• Reports: ARM China makes independent move in autonomous driving (Tuesday, August 31, 2021)
• Xilinx and Motovis Introduce Complete Hardware and Software Solution to Further Automotive Forward Camera Innovation (Monday, August 30, 2021)
• Lattice Semi Tunes its FPGA For Auto Apps (Wednesday, August 25, 2021)
• MIPI DSI-2 boosts user-experience in mobile/automotive displays (Monday, August 23, 2021)
• Dialog launches new family of auto buck converters (Wednesday, August 18, 2021)
• AV Safety-Report Scorecard Reveals Gaps in Information (Monday, August 16, 2021)
• AV Safety-Report Scorecard Reveals Gaps in Information (Monday, August 16, 2021)
• Tower Semiconductor and Cadence Announce New Reference Flow for Advanced 5G Communications and Automotive IC Development (Sunday, August 15, 2021)
• Automotive MCU Market to Surge 23% in 2021 Despite Shortages (Wednesday, August 11, 2021)
• Why Sensor Technology is the Key to Autonomous Vehicles (Tuesday, August 10, 2021)
• Mixel Achieves ISO 26262 for Automotive Functional Safety and ISO 9001 Certification for IP Quality Management System (Monday, August 9, 2021)
• CAST IP Helps Socionext Develop Advanced Autonomous Driving Systems (Wednesday, August 4, 2021)
• Printed Electronics to Enhance both Exteriors and Interiors in EVs (Monday, August 2, 2021)
• NSITEXE achieves world's first RISC-V processor with vector extension certified for ISO 26262 ASIL D ready product (Sunday, August 1, 2021)
• Tensilica Xtensa processors address stringent automotive safety requirements (Wednesday, July 28, 2021)
• Cadence Tensilica Xtensa Processors Address Most Stringent Automotive Functional Safety Requirements with Full ISO 26262 Compliance to ASIL-D (Tuesday, July 27, 2021)
• CAST And Avery Design Systems Expand IP Partnership to Support Next Generation High-Bandwidth Automotive Networking And Control Systems (Monday, July 26, 2021)
• Samsung Foundry and Synopsys Collaborate to Accelerate Time to ISO 26262 Compliance for Automotive SoCs (Sunday, July 18, 2021)
• Rethinking Automotive Electronics Networks (Tuesday, July 13, 2021)
• TTTech Aerospace releases the world's first 1 Gbit/s A664 End System IP certified to the highest civil aviation standards (Monday, July 12, 2021)
• Solid-State LiDAR Empowers ADAS, Autonomous Driving (Tuesday, July 6, 2021)
• Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line (Tuesday, June 29, 2021)
• Automobile In-Vehicle Networks–Ethernet, SERDES, or Both? (Monday, June 28, 2021)
• Driverless Car Group Eyes AV Safety Standard (Monday, June 28, 2021)
• GUC and Omni Design Tape Out 16nm LiDAR SoC (Wednesday, June 23, 2021)
• Advanced driver-assistance systems (ADAS) (Tuesday, June 22, 2021)
• Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets (Wednesday, June 16, 2021)
• Spain Outlines Vision for Industrial AI (Wednesday, June 16, 2021)
• Germany Leads the Autonomous Vehicle Regulation Race (Monday, June 14, 2021)
• LiDAR solution looks to address transportation infrastructure monitoring (Sunday, June 13, 2021)
• Automotive IC Marketshare Slips in 2020 After Steady Gains Since 1998 (Tuesday, June 8, 2021)
• Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips (Monday, June 7, 2021)
• Automotive Software & Cybersecurity (Sunday, June 6, 2021)
• Sondrel launches the fourth IP platform – SFA 350A – that delivers faster time to market for ADAS ASICs (Wednesday, June 2, 2021)
• NXP Ramps Automotive Processing Innovation with Two Processors on TSMC 16nm FinFET Technology (Tuesday, June 1, 2021)
• Now Your Car is a Cybersecurity Risk, Too (Thursday, May 20, 2021)
• Real Intent Expands ISO 26262 Functional Safety Compliance for Static Sign-Off Products (Tuesday, May 11, 2021)
• MIPI Alliance releases automotive specifications (Sunday, May 9, 2021)
• MIPI Alliance Releases Specifications to Streamline Integration of In-Vehicle Displays, Add Functional Safety to Display Data Streams (Monday, May 3, 2021)
• EnSilica Mixed Signal ASIC is PPAP Approved for Luxury Hybrid Car (Wednesday, April 28, 2021)
• Valens Announces Successful Tapeout of First MIPI A-PHY Compliant Chipsets for Long-Reach, Ultra-High-Speed Automotive Connectivity (Tuesday, April 27, 2021)
• Automotive Ethernet PHY addresses next-gen connected cars (Monday, April 26, 2021)
• EnSilica completes PPAP on safety-critical automotive ASIC design (Wednesday, April 21, 2021)