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Design Platform News

• ADTechnology to launch its 5nm A53-based Platform, ADP500™ based on Samsung Foundry (Tuesday, May 24, 2022)
• Synopsys and Analog Devices Collaborate to Accelerate Power System Design (Sunday, May 22, 2022)
• Imagination Joins Baidu PaddlePaddle (Thursday, May 19, 2022)
• Cadence Digital Full Flow Achieves Certification for GlobalFoundries 12LP/12LP+ Process Platforms (Wednesday, May 18, 2022)
• Arasan Announces its latest MIPI RFFE(SM) IP compliant to MIPI RFFE(SM) v3.0 Version (Tuesday, May 17, 2022)
• First ARM SystemReady certification for the data centre (Sunday, May 15, 2022)
• Introducing the largest portfolio of Verification IP Cores for all types of Testbench verifications of different protocols and interfaces for your advanced Design IPs which are now available for immediate licensing (Sunday, May 15, 2022)
• Faraday Continues Expanding Its Ethernet Solutions for Networking Demands in ASIC (Wednesday, May 11, 2022)
• ADTechnology Receives Samsung Foundry 2022 Best Engineering Award for Design Service Collaboration (Wednesday, May 11, 2022)
• Samsung Launches Industry's First 512GB CXL Memory Module (Tuesday, May 10, 2022)
• Silicon Creations and Achronix Semiconductor Partner to Drive More Performance, Flexibility into High-Speed Trading (Tuesday, May 10, 2022)
• Capgemini has been selected by Airbus to implement a large-scale cloud transformation program driving innovation and sustainability (Monday, May 9, 2022)
• Latest Attopsemi I-fuse OTP Memories Based on Ground-Breaking New Architecture Now Available on X-FAB's 180 nm Technology (Monday, May 9, 2022)
• USB 3.0 PHY IP Cores in 16FFC process technology with High-performance backplane interconnect licensed to a Chinese company for Multimedia SoC application (Sunday, May 8, 2022)
• Using Agile Analog's process-agnostic Analog IPs can help solve current Semiconductor capacity challenges (Wednesday, May 4, 2022)
• Safer "Listen Through" earbuds create headaches for developers due to increased processing demands (Tuesday, May 3, 2022)
• Codasip adopts Siemens' OneSpin tools for formal verification (Monday, May 2, 2022)
• GbE (10/100/1000Base-T) PHY IP Cores with matching 1G Ethernet MAC, PCS and TSN MAC Controller IP Cores for all your high-speed Ethernet Networking applications is available for immediate licensing (Sunday, May 1, 2022)
• VLAB Works enables Embedded Applications with VLAB VDMs (Sunday, May 1, 2022)
• (R)evolution in I3C? (Wednesday, April 27, 2022)
• Arasan Announces its eMMC 5.1 Total IP Solution for 5nm SoC Designs (Wednesday, April 27, 2022)
• 16G Multiprotocol Serdes IP Core with different Interface protocols for your High-Speed interconnect requirements in 28HPC+ process technology is available for immediate licensing (Sunday, April 24, 2022)
• JESD204B Tx & Rx SerDes IP Core (12.5Gbps & 16Gbps) in 28HPC+ and 40LL process technologies for High-Speed Serial Interface with Matching Controller IP Core is available for immediate licensing (Monday, April 18, 2022)
• MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm (Sunday, April 17, 2022)
• Renesas Introduces Industry's First PCIe Gen6 Clock Buffers and Multiplexers (Wednesday, April 13, 2022)
• Synopsys Study Highlights Challenges with Managing Open Source Risk in Software Supply Chains (Wednesday, April 13, 2022)
• SiemensÂ’ New mPower Digital Solution Now Certified for GlobalFoundriesÂ’ Platforms (Tuesday, April 12, 2022)
• Photonic quantum computer made in Germany (Monday, April 11, 2022)
• New Cadence High-Speed Ethernet Controller IP Family Enables Silicon-Proven Ethernet Subsystem Solutions up to 800Gbps (Monday, April 11, 2022)
• Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design (Sunday, April 10, 2022)
• CFX announces commercial availability of anti-fuse OTP technology on 28HV process (Sunday, April 10, 2022)
• Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase (Wednesday, April 6, 2022)
• Sondrel warns that packaging lead time have dramatically increased from 8 to more than 50 weeks (Wednesday, April 6, 2022)
• Sondrel warns that packaging lead times have jumped to more than 50 weeks (Tuesday, April 5, 2022)
• New Arm-based cloud services from Microsoft highlight the power of choice in computing (Monday, April 4, 2022)
• MIPI UFS Controller, MIPI Unipro Controller and MIPI M-PHY IP Cores available in different Fabs and Nodes for all High-density Flash Storage applications in advanced SoCs (Monday, April 4, 2022)
• M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud (Wednesday, March 30, 2022)
• Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development (Wednesday, March 30, 2022)
• ARIES Embedded Presents New MCXL Reference IP Design (Wednesday, March 30, 2022)
• Synopsys Launches Industry's First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape (Tuesday, March 29, 2022)
• Edgewater Wireless selects CMC Microsystems as fabrication services Partner (Monday, March 28, 2022)
• Advancing VHDL's Verification Capabilities with VHDL-2019 Protected Types (Monday, March 28, 2022)
• Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing (Sunday, March 27, 2022)
• Cadence Selected by Microsoft for RAMP Phase II Program (Wednesday, March 23, 2022)
• CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale (Wednesday, March 23, 2022)
• O-RAN Fronthaul Transport Subsystem is now available (Wednesday, March 23, 2022)
• Avalanche Technology and Efabless Partner for System-On-Chip Development using Google's Open-Source Program (Monday, March 21, 2022)
• Xylon Demonstrates Hot Swapping of Programmable FPGA/SoC Chip Parts (Wednesday, March 16, 2022)
• Intrinsic ID Optimizes SRAM PUF Security Technology for Advanced Process Nodes with QuiddiKey 4.x (Wednesday, March 16, 2022)
• Synopsys Improves Interoperability Between CODE V and LightTools (Monday, March 14, 2022)