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• sureCore teams with Sarcina to package cryo chips (Monday, December 16, 2024)
• MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC (Wednesday, December 11, 2024)
• MosChip selects Cadence tools for the design of HPC Processor "AUM" for C-DAC (Tuesday, December 10, 2024)
• Silvaco Joins SMART USA Institute to Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program (Tuesday, December 3, 2024)
• Marvell Unveils Industry's First 3nm 1.6 Tbps PAM4 Interconnect Platform to Scale Accelerated Infrastructure (Monday, December 2, 2024)
• Arteris Deployed by Menta for Edge AI Chiplet Platform (Monday, December 2, 2024)
• HPC customer engages Sondrel for high end chip design (Thursday, November 21, 2024)
• Solid Sands and VyperCore Collaborate to Ensure C/C++ Compliance in New Accelerator Chip Design (Wednesday, November 20, 2024)
• Renesas Introduces Industry's First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs (Tuesday, November 19, 2024)
• NVIDIA Announces Omniverse Real-Time Physics Digital Twins With Industry Software Leaders (Sunday, November 17, 2024)
• Siemens Launches TIA Portal Version 20 Focused on Improved Performance (Friday, November 15, 2024)
• Siemens presents next-generation AI-supported software for electronic system design (Thursday, November 14, 2024)
• Siemens extends Veloce hardware-assisted verification and validation with new Innexis shift-left software (Monday, November 11, 2024)
• Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC (Sunday, November 10, 2024)
• Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC (Sunday, November 10, 2024)
• Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle (Monday, November 4, 2024)
• Research for the future, application transfer for the present (Sunday, November 3, 2024)
• Faraday Unveils HiSpeedKit?-HS Platform for High-speed Interface IP Verification in SoCs (Tuesday, October 29, 2024)
• Siemens and CELUS collaborate to empower SMBs with AI-powered PCB design (Monday, October 28, 2024)
• Keysight collaborates with Siemens EDA enabling next generation of wireless design (Monday, October 21, 2024)
• EnSilica plc - Award of £2 million Controller ASIC Design Services Contract (Sunday, October 20, 2024)
• Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company (Tuesday, October 15, 2024)
• Agile Analog announces MoU to support new Southern Taiwan IC Design Industry (Monday, October 14, 2024)
• Siemens Updates Simcenter Testlab for Advanced Manufacturers (Sunday, October 13, 2024)
• SensiML Expands Platform Support to Include the RISC-V Architecture (Wednesday, October 9, 2024)
• Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication (Monday, October 7, 2024)
• South Korean AI IC Design Companies Shifting to Dual-Foundry Model with Both Samsung and TSMC (Thursday, October 3, 2024)
• Faraday Enhances 3D-IC Design Service with Ansys Multiphysics Analysis (Tuesday, October 1, 2024)
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service (Sunday, September 29, 2024)
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Wednesday, September 25, 2024)
• Boosting Efficiency and Reducing Costs: SilvacoÂ’s Approach to Semiconductor Fabrication (Tuesday, September 24, 2024)
• Silvaco Expands its Victory TCAD and Digital Twin Modeling Platform to Planar CMOS, FinFET and Advanced CMOS Technologies (Tuesday, September 24, 2024)
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Monday, September 23, 2024)
• RAAAM Memory Technologies and NXP Semiconductors Announce Collaboration to Implement High Density On-Chip Memory (Sunday, September 22, 2024)
• Comcores and Extoll successfully completed the interoperability test of Comcores JESD204C IP core and Extoll SerDes PHY (Sunday, September 22, 2024)
• Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium (Sunday, September 22, 2024)
• Siemens brings industry leading Capital electrical and electronic systems design software to the cloud as a service (Friday, August 30, 2024)
• Technology combinations for complex chip (Friday, August 30, 2024)
• Silvaco's Fab Technology Co-Optimization (FTCO): From Atoms to Systems (Tuesday, August 20, 2024)
• Welcome to Silicon-to-Systems Space (Where No One Can Hear You Scream) (Thursday, August 15, 2024)
• AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC (Wednesday, August 14, 2024)
• BAE Systems Partners with Siemens for Industry 4.0 Revolution (Tuesday, July 30, 2024)
• Tessolve partners with SigmaSense to develop their innovative DSP-based sensing ASIC (Monday, July 29, 2024)
• Imec achieves record-low charge noise for Si MOS quantum dots fabricated on a 300mm CMOS platform (Wednesday, July 24, 2024)
• C-DAC partners with MosChip and Socionext for design of HPC Processor AUM based on Arm architecture (Monday, July 1, 2024)
• Creating a Center of Excellence for IC Design (Sunday, June 30, 2024)
• EDA Companies Unite With Samsung for AI and 3D IC Technology (Saturday, June 29, 2024)
• Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing (Monday, June 24, 2024)
• Siemens gets certification for Solido SPICE on Intel nodes, and adds EMIB (Monday, June 24, 2024)
• True Circuits Introduces the JSPICE™ Design Environment (JDE™) at the Design Automation Conference (Sunday, June 23, 2024)